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treewide: Add SPDX license identifier - Makefile/Kconfig Add SPDX license identifiers to all Make/Kconfig files which: - Have no license information of any form These files fall under the project license, GPL v2 only. The resulting SPDX license identifier is: GPL-2.0-only Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-05-19 15:07:45 +03:00
# SPDX-License-Identifier: GPL-2.0-only
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 10:51:08 +03:00
#
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 23:45:27 +03:00
# Generic thermal drivers configuration
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 10:51:08 +03:00
#
menuconfig THERMAL
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 23:45:27 +03:00
bool "Thermal drivers"
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 10:51:08 +03:00
help
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 23:45:27 +03:00
Thermal drivers offer a generic mechanism for
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 10:51:08 +03:00
thermal management. Usually it's made up of one or more thermal
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 23:45:27 +03:00
zones and cooling devices.
ACPI: thermal: syntax, spelling, kernel-doc Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-08 00:55:08 +03:00
Each thermal zone contains its own temperature, trip points,
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 23:45:27 +03:00
and cooling devices.
All platforms with ACPI or Open Firmware thermal support can use
this driver.
thermal/drivers/core: Remove the module Kconfig's option The module support for the thermal subsystem makes little sense: - some subsystems relying on it are not modules, thus forcing the framework to be compiled in - it is compiled in for almost every configs, the remaining ones are a few platforms where I don't see why we can not switch the thermal to 'y'. The drivers can stay in tristate. - platforms need the thermal to be ready as soon as possible at boot time in order to mitigate Usually the subsystems framework are compiled-in and the plugs are as module. Remove the module option. The removal of the module related dead code will come after this patch gets in or is acked. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <groeck@chromium.org> For mini2440: Acked-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part Acked-by: Robert Jarzmik <robert.jarzmik@free.fr> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-04-02 19:12:44 +03:00
If you want this support, you should say Y here.
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 21:38:56 +04:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
if THERMAL
thermal: netlink: Fix compilation error when CONFIG_NET=n When the network is not configured, the netlink is disabled on all the system. The thermal framework assumed the netlink is always opt-in. Fix this by adding a Kconfig option for the netlink notification, defaulting to yes and depending on CONFIG_NET. As the change implies multiple stubs and in order to not pollute the internal thermal header, the thermal_nelink.h has been added and included in the thermal_core.h, so this one regain some kind of clarity. Reported-by: Randy Dunlap <rdunlap@infradead.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
2020-07-07 12:01:57 +03:00
config THERMAL_NETLINK
bool "Thermal netlink management"
depends on NET
help
The thermal framework has a netlink interface to do thermal
zones discovery, temperature readings and events such as
trip point crossed, cooling device update or governor
change. It is recommended to enable the feature.
thermal: Add cooling device's statistics in sysfs This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-02 13:56:25 +03:00
config THERMAL_STATISTICS
bool "Thermal state transition statistics"
help
Export thermal state transition statistics information through sysfs.
If in doubt, say N.
thermal: core: Add a back up thermal shutdown mechanism orderly_poweroff is triggered when a graceful shutdown of system is desired. This may be used in many critical states of the kernel such as when subsystems detects conditions such as critical temperature conditions. However, in certain conditions in system boot up sequences like those in the middle of driver probes being initiated, userspace will be unable to power off the system in a clean manner and leaves the system in a critical state. In cases like these, the /sbin/poweroff will return success (having forked off to attempt powering off the system. However, the system overall will fail to completely poweroff (since other modules will be probed) and the system is still functional with no userspace (since that would have shut itself off). However, there is no clean way of detecting such failure of userspace powering off the system. In such scenarios, it is necessary for a backup workqueue to be able to force a shutdown of the system when orderly shutdown is not successful after a configurable time period. Reported-by: Nishanth Menon <nm@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-04-18 07:29:59 +03:00
config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
int "Emergency poweroff delay in milli-seconds"
default 0
help
Thermal subsystem will issue a graceful shutdown when
critical temperatures are reached using orderly_poweroff(). In
case of failure of an orderly_poweroff(), the thermal emergency
poweroff kicks in after a delay has elapsed and shuts down the system.
This config is number of milliseconds to delay before emergency
poweroff kicks in. Similarly to the critical trip point,
the delay should be carefully profiled so as to give adequate
time for orderly_poweroff() to finish on regular execution.
If set to 0 emergency poweroff will not be supported.
In doubt, leave as 0.
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 21:38:56 +04:00
config THERMAL_HWMON
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 00:48:40 +04:00
bool
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 23:14:28 +04:00
prompt "Expose thermal sensors as hwmon device"
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 21:38:56 +04:00
depends on HWMON=y || HWMON=THERMAL
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 00:48:40 +04:00
default y
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 23:14:28 +04:00
help
In case a sensor is registered with the thermal
framework, this option will also register it
as a hwmon. The sensor will then have the common
hwmon sysfs interface.
Say 'Y' here if you want all thermal sensors to
have hwmon sysfs interface too.
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-21 23:55:03 +04:00
thermal: introduce device tree parser This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 23:35:39 +04:00
config THERMAL_OF
bool
prompt "APIs to parse thermal data out of device tree"
depends on OF
default y
help
This options provides helpers to add the support to
read and parse thermal data definitions out of the
device tree blob.
Say 'Y' here if you need to build thermal infrastructure
based on device tree.
thermal: ACPI: Add ACPI trip point routines Add library routines to populate a generic thermal trip point structure with data obtained by evaluating a specific object in the ACPI Namespace. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2023-01-23 21:38:31 +03:00
config THERMAL_ACPI
depends on ACPI
bool
thermal: core: Add Kconfig option to enable writable trips Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-03 13:43:03 +03:00
config THERMAL_WRITABLE_TRIPS
bool "Enable writable trip points"
help
This option allows the system integrator to choose whether
trip temperatures can be changed from userspace. The
writable trips need to be specified when setting up the
thermal zone but the choice here takes precedence.
Say 'Y' here if you would like to allow userspace tools to
change trip temperatures.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
choice
prompt "Default Thermal governor"
default THERMAL_DEFAULT_GOV_STEP_WISE
help
This option sets which thermal governor shall be loaded at
startup. If in doubt, select 'step_wise'.
config THERMAL_DEFAULT_GOV_STEP_WISE
bool "step_wise"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
select THERMAL_GOV_STEP_WISE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
help
Use the step_wise governor as default. This throttles the
devices one step at a time.
config THERMAL_DEFAULT_GOV_FAIR_SHARE
bool "fair_share"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
select THERMAL_GOV_FAIR_SHARE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
help
Use the fair_share governor as default. This throttles the
devices based on their 'contribution' to a zone. The
contribution should be provided through platform data.
config THERMAL_DEFAULT_GOV_USER_SPACE
bool "user_space"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
select THERMAL_GOV_USER_SPACE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
help
thermal/governor: Remove deprecated information The userspace governor is still in use on production systems and the deprecating warning is scary. Even if we want to get rid of the userspace governor, it is too soon yet as the alternatives are not yet adopted. Change the deprecated warning by an information message suggesting to switch to the netlink thermal events. Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated") Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-04-22 17:10:29 +03:00
The Userspace governor allows to get trip point crossed
notification from the kernel via uevents. It is recommended
to use the netlink interface instead which gives richer
information about the thermal framework events.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 20:17:19 +03:00
config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
bool "power_allocator"
thermal: power_allocator: Fix Kconfig warning When do randbuiding, we got this: WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n] Selected by [y]: - THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice> The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL which is not enabled. Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR to fix this warning. Suggested-by: Quentin Perret <qperret@google.com> Fixes: a4e893e802e6 ("thermal: cpu_cooling: Migrate to using the EM framework") Signed-off-by: YueHaibing <yuehaibing@huawei.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com
2019-11-13 13:53:13 +03:00
depends on THERMAL_GOV_POWER_ALLOCATOR
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 20:17:19 +03:00
help
Select this if you want to control temperature based on
system and device power allocation. This governor can only
operate on cooling devices that implement the power API.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
endchoice
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
config THERMAL_GOV_FAIR_SHARE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
bool "Fair-share thermal governor"
help
Enable this to manage platform thermals using fair-share governor.
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
config THERMAL_GOV_STEP_WISE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
bool "Step_wise thermal governor"
help
Enable this to manage platform thermals using a simple linear
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-27 22:20:33 +04:00
governor.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
thermal: Added Bang-bang thermal governor The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-22 19:37:13 +04:00
config THERMAL_GOV_BANG_BANG
bool "Bang Bang thermal governor"
default n
help
Enable this to manage platform thermals using bang bang governor.
Say 'Y' here if you want to use two point temperature regulation
used for fans without throttling. Some fan drivers depend on this
governor to be enabled (e.g. acerhdf).
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 16:33:42 +04:00
config THERMAL_GOV_USER_SPACE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
bool "User_space thermal governor"
help
Enable this to let the user space manage the platform thermals.
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 20:17:19 +03:00
config THERMAL_GOV_POWER_ALLOCATOR
bool "Power allocator thermal governor"
thermal: cpu_cooling: Migrate to using the EM framework The newly introduced Energy Model framework manages power cost tables in a generic way. Moreover, it supports several types of models since the tables can come from DT or firmware (through SCMI) for example. On the other hand, the cpu_cooling subsystem manages its own power cost tables using only DT data. In order to avoid the duplication of data in the kernel, and in order to enable IPA with EMs coming from more than just DT, remove the private tables from cpu_cooling.c and migrate it to using the centralized EM framework. Doing so should have no visible functional impact for existing users of IPA since: - recent extenstions to the the PM_OPP infrastructure enable the registration of EMs in PM_EM using the DT property used by IPA; - the existing upstream cpufreq drivers marked with the 'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP infrastructure, which means they all support PM_EM. The only two exceptions are qoriq-cpufreq which doesn't in fact use an EM and scmi-cpufreq which doesn't use DT for power costs. For existing users of cpu_cooling, PM_EM tables will contain the exact same power values that IPA used to compute on its own until now. The only new dependency for them is to compile in CONFIG_ENERGY_MODEL. The case where the thermal subsystem is used without an Energy Model (cpufreq_cooling_ops) is handled by looking directly at CPUFreq's frequency table which is already a dependency for cpu_cooling.c anyway. Since the thermal framework expects the cooling states in a particular order, bail out whenever the CPUFreq table is unsorted, since that is fairly uncommon in general, and there are currently no users of cpu_cooling for this use-case. Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Quentin Perret <qperret@google.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com
2019-10-30 18:14:51 +03:00
depends on ENERGY_MODEL
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 20:17:19 +03:00
help
Enable this to manage platform thermals by dynamically
allocating and limiting power to devices.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
config CPU_THERMAL
thermal/drivers/core: Fix typo in the option name Unlike the other options, the cpu cooling option is beginning with a lowercase letter, changing to a uppercase. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-04-02 19:12:49 +03:00
bool "Generic cpu cooling support"
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-13 03:26:45 +04:00
depends on THERMAL_OF
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 18:39:27 +03:00
help
Enable the CPU cooling features. If the system has no active
cooling device available, this option allows to use the CPU
as a cooling device.
if CPU_THERMAL
config CPU_FREQ_THERMAL
bool "CPU frequency cooling device"
depends on CPU_FREQ
default y
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
help
This implements the generic cpu cooling mechanism through frequency
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 21:12:10 +04:00
reduction. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c).
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
This will be useful for platforms using the generic thermal interface
and not the ACPI interface.
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 21:12:10 +04:00
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2019-12-20 01:53:16 +03:00
config CPU_IDLE_THERMAL
bool "CPU idle cooling device"
depends on IDLE_INJECT
help
This implements the CPU cooling mechanism through
idle injection. This will throttle the CPU by injecting
idle cycle.
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 18:39:27 +03:00
endif
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
thermal: Add devfreq cooling Add a generic thermal cooling device for devfreq, that is similar to cpu_cooling. The device must use devfreq. In order to use the power extension of the cooling device, it must have registered its OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Ørjan Eide <orjan.eide@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 20:09:30 +03:00
config DEVFREQ_THERMAL
bool "Generic device cooling support"
depends on PM_DEVFREQ
depends on PM_OPP
help
This implements the generic devfreq cooling mechanism through
frequency reduction for devices using devfreq.
This will throttle the device by limiting the maximum allowed DVFS
frequency corresponding to the cooling level.
In order to use the power extensions of the cooling device,
devfreq should use the simple_ondemand governor.
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 17:04:18 +04:00
If you want this support, you should say Y here.
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-04 04:30:15 +04:00
config THERMAL_EMULATION
bool "Thermal emulation mode support"
help
Enable this option to make a emul_temp sysfs node in thermal zone
directory to support temperature emulation. With emulation sysfs node,
user can manually input temperature and test the different trip
threshold behaviour for simulation purpose.
thermal: add a warning for temperature emulation feature Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-27 01:38:34 +04:00
WARNING: Be careful while enabling this option on production systems,
because userland can easily disable the thermal policy by simply
flooding this sysfs node with low temperature values.
thermal: Introduce Amazon's Annapurna Labs Thermal Driver This is a generic thermal driver for simple MMIO sensors, of which amazon,al-thermal is one. This device uses a single MMIO transaction to read the temperature and report it to the thermal subsystem. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-11 13:22:48 +03:00
config THERMAL_MMIO
tristate "Generic Thermal MMIO driver"
thermal: Drop obsolete dependency on COMPILE_TEST Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. It is actually better to always build such drivers with OF enabled, so that the test builds are closer to how each driver will actually be built on its intended target. Building them without OF may not test much as the compiler will optimize out potentially large parts of the code. In the worst case, this could even pop false positive warnings. Dropping COMPILE_TEST here improves the quality of our testing and avoids wasting time on non-existent issues. Signed-off-by: Jean Delvare <jdelvare@suse.de> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-31 15:13:52 +03:00
depends on OF
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/thermal/thermal_mmio.o: In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1): undefined reference to `devm_ioremap_resource' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Reported-by: kbuild test robot <lkp@intel.com> Signed-off-by: Talel Shenhar <talel@amazon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-29 12:47:36 +03:00
depends on HAS_IOMEM
thermal: Introduce Amazon's Annapurna Labs Thermal Driver This is a generic thermal driver for simple MMIO sensors, of which amazon,al-thermal is one. This device uses a single MMIO transaction to read the temperature and report it to the thermal subsystem. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-11 13:22:48 +03:00
help
This option enables the generic thermal MMIO driver that will use
memory-mapped reads to get the temperature. Any HW/System that
allows temperature reading by a single memory-mapped reading, be it
register or shared memory, is a potential candidate to work with this
driver.
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 14:16:37 +03:00
config HISI_THERMAL
tristate "Hisilicon thermal driver"
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 11:50:16 +03:00
depends on ARCH_HISI || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 11:50:16 +03:00
depends on OF
default y
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 14:16:37 +03:00
help
Enable this to plug hisilicon's thermal sensor driver into the Linux
thermal framework. cpufreq is used as the cooling device to throttle
CPUs when the passive trip is crossed.
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 10:30:44 +04:00
config IMX_THERMAL
tristate "Temperature sensor driver for Freescale i.MX SoCs"
thermal: imx: fix for dependency on cpu-freq The thermal driver is a standalone driver for monitoring SoC temperature by enabling thermal sensor, so it can be enabled even when CONFIG_CPU_FREQ is NOT set. So remove the dependency with CPU_THERMAL. Introduce dummy function of legacy cooling register/unregister to make thermal driver probe successfully when CONFIG_CPU_FREQ is NOT set. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-11-21 08:49:36 +03:00
depends on ARCH_MXC || COMPILE_TEST
thermal: imx: add NVMEM dependency The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable module: drivers/thermal/imx_thermal.o: In function `imx_thermal_probe': imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32' imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32' imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32' imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32' This adds a Kconfig dependency to force it to be a module as well when its dependency is loadable. Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem") Signed-off-by: Arnd Bergmann <arnd@arndb.de> Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-09-18 23:48:16 +03:00
depends on NVMEM || !NVMEM
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 10:30:44 +04:00
depends on MFD_SYSCON
depends on OF
help
Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
thermal: imx_sc: add i.MX system controller thermal support i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-02-22 03:08:50 +03:00
config IMX_SC_THERMAL
tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
thermal: Remove COMPILE_TEST for IMX_SC_THERMAL i.MX SCU thermal driver depends on IMX_SCU which does NOT have COMPILE_TEST enabled, so need to remove COMPILE_TEST for i.MX SCU thermal as well. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reported-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583222684-10229-2-git-send-email-Anson.Huang@nxp.com
2020-03-03 11:04:44 +03:00
depends on IMX_SCU
thermal: imx_sc: add i.MX system controller thermal support i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-02-22 03:08:50 +03:00
depends on OF
help
Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
system controller inside, Linux kernel has to communicate with system
controller via MU (message unit) IPC to get temperature from thermal
sensor. It supports one critical trip point and one
passive trip point for each thermal sensor.
thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
2020-02-29 06:44:20 +03:00
config IMX8MM_THERMAL
tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
thermal: Add COMPILE_TEST support for i.MX8MM Add COMPILE_TEST support to i.MX8MM thermal driver for better compile testing coverage. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583509057-8197-1-git-send-email-Anson.Huang@nxp.com
2020-03-06 18:37:37 +03:00
depends on ARCH_MXC || COMPILE_TEST
thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
2020-02-29 06:44:20 +03:00
depends on OF
help
Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the passive
trip is crossed.
thermal: k3: Add support for bandgap sensors Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
2020-04-07 08:51:14 +03:00
config K3_THERMAL
tristate "Texas Instruments K3 thermal support"
depends on ARCH_K3 || COMPILE_TEST
help
If you say yes here you get thermal support for the Texas Instruments
K3 SoC family. The current chip supported is:
- AM654
This includes temperature reading functionality.
thermal: max77620: Add thermal driver for reporting junction temp Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-08-23 11:20:27 +03:00
config MAX77620_THERMAL
tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
depends on MFD_MAX77620
depends on OF
help
Support for die junction temperature warning alarm for Maxim
Semiconductor PMIC MAX77620 device. Device generates two alarm
interrupts when PMIC die temperature cross the threshold of
120 degC and 140 degC.
thermal: qoriq: Add thermal management support This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-06-30 06:08:38 +03:00
config QORIQ_THERMAL
tristate "QorIQ Thermal Monitoring Unit"
thermal: qoriq: Add platform dependencies The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies to the QORIQ_THERMAL config symbol, to avoid asking the user about it when configuring a kernel without support for any of the aforementioned SoCs. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Li Yang <leoyang.li@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
2020-05-07 14:29:55 +03:00
depends on THERMAL_OF && HAS_IOMEM
depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
thermal: qoriq: Fix a compiling issue Qoriq thermal driver is used by both PowerPC and ARM architecture. When built for PowerPC architecture, it reports error: undefined reference to `.__devm_regmap_init_mmio_clk' To fix it, select config REGMAP_MMIO. Fixes: 4316237bd627 (thermal: qoriq: Convert driver to use regmap API) Signed-off-by: Yuantian Tang <andy.tang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200303084641.35687-1-andy.tang@nxp.com
2020-03-03 11:46:41 +03:00
select REGMAP_MMIO
thermal: qoriq: Add thermal management support This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-06-30 06:08:38 +03:00
help
Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-21 23:55:03 +04:00
config SPEAR_THERMAL
thermal: allow spear-thermal driver to be a module When the thermal subsystem is a loadable module, the spear driver fails to build: drivers/thermal/built-in.o: In function `spear_thermal_exit': spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister' drivers/thermal/built-in.o: In function `spear_thermal_probe': spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-25 19:44:11 +03:00
tristate "SPEAr thermal sensor driver"
thermal: spear: allow compile test Adding COMPILE_TEST flag to spear driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:42:01 +03:00
depends on PLAT_SPEAR || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
drivers/thermal/spear_thermal.c: add Device Tree probing capability SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-05-29 22:18:51 +04:00
depends on OF
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-21 23:55:03 +04:00
help
Enable this to plug the SPEAr thermal sensor driver into the Linux
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-27 22:20:33 +04:00
thermal framework.
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 04:53:48 +04:00
thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40 This patch adds the support for allwinner thermal sensor, within allwinner SoC. It will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Ondrej Jirman <megous@megous.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
2019-12-19 20:28:17 +03:00
config SUN8I_THERMAL
tristate "Allwinner sun8i thermal driver"
depends on ARCH_SUNXI || COMPILE_TEST
depends on HAS_IOMEM
depends on NVMEM
depends on OF
depends on RESET_CONTROLLER
help
Support for the sun8i thermal sensor driver into the Linux thermal
framework.
To compile this driver as a module, choose M here: the
module will be called sun8i-thermal.
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 07:58:59 +03:00
config ROCKCHIP_THERMAL
tristate "Rockchip thermal driver"
thermal: rockchip: allow compile test Adding COMPILE_TEST flag to rockchip driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Heiko Stuebner <heiko@sntech.de> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-rockchip@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:43:57 +03:00
depends on ARCH_ROCKCHIP || COMPILE_TEST
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 07:58:59 +03:00
depends on RESET_CONTROLLER
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 07:58:59 +03:00
help
Rockchip thermal driver provides support for Temperature sensor
ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
trip point. Cpufreq is used as the cooling device and will throttle
CPUs when the Temperature crosses the passive trip point.
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 04:53:48 +04:00
config RCAR_THERMAL
tristate "Renesas R-Car thermal driver"
thermal: rcar: Use ARCH_RENESAS Make use of ARCH_RENESAS in place of ARCH_SHMOBILE. This is part of an ongoing process to migrate from ARCH_SHMOBILE to ARCH_RENESAS the motivation for which being that RENESAS seems to be a more appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs. Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-02 05:04:26 +03:00
depends on ARCH_RENESAS || COMPILE_TEST
thermal,rcar_thermal: Add dependency on HAS_IOMEM Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST) broke build on archs wihout io memory. On archs like S390 or um this driver cannot build nor work. Make it depend on HAS_IOMEM to bypass build failures. drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource' drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource' Signed-off-by: Richard Weinberger <richard@nod.at> Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com> Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-27 12:40:58 +04:00
depends on HAS_IOMEM
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 04:53:48 +04:00
help
Enable this to plug the R-Car thermal sensor driver into the Linux
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-27 22:20:33 +04:00
thermal framework.
hwmon: exynos4: move thermal sensor driver to driver/thermal directory This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:41 +04:00
thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver Add support for R-Car Gen3 thermal sensors. Polling only for now, interrupts will be added incrementally. Same goes for reading fuses. This is documented already, but no hardware available for now. Signed-off-by: Hien Dang <hien.dang.eb@renesas.com> Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com> Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com> Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> [Niklas: document and rework temperature calculation] Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-12-22 13:38:21 +03:00
config RCAR_GEN3_THERMAL
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the description to reflect this. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200917152141.30070-1-prabhakar.mahadev-lad.rj@bp.renesas.com
2020-09-17 18:21:41 +03:00
tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver Add support for R-Car Gen3 thermal sensors. Polling only for now, interrupts will be added incrementally. Same goes for reading fuses. This is documented already, but no hardware available for now. Signed-off-by: Hien Dang <hien.dang.eb@renesas.com> Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com> Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com> Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> [Niklas: document and rework temperature calculation] Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-12-22 13:38:21 +03:00
depends on ARCH_RENESAS || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the description to reflect this. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200917152141.30070-1-prabhakar.mahadev-lad.rj@bp.renesas.com
2020-09-17 18:21:41 +03:00
Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
the Linux thermal framework.
thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver Add support for R-Car Gen3 thermal sensors. Polling only for now, interrupts will be added incrementally. Same goes for reading fuses. This is documented already, but no hardware available for now. Signed-off-by: Hien Dang <hien.dang.eb@renesas.com> Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com> Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com> Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> [Niklas: document and rework temperature calculation] Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-12-22 13:38:21 +03:00
thermal/drivers: Add TSU driver for RZ/G2L The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the temperature inside the LSI. The thermal sensor in this unit measures temperatures in the range from −40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The TSU repeats measurement at 20 microseconds intervals and automatically updates the results of measurement. The TSU has no interrupts as well as no external pins. This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-11-30 18:57:57 +03:00
config RZG2L_THERMAL
tristate "Renesas RZ/G2L thermal driver"
depends on ARCH_RENESAS || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Enable this to plug the RZ/G2L thermal sensor driver into the Linux
thermal framework.
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:24 +04:00
config KIRKWOOD_THERMAL
tristate "Temperature sensor on Marvell Kirkwood SoCs"
thermal: kirkwood: allow compile test Adding COMPILE_TEST flag to kirkwood driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:44:46 +03:00
depends on MACH_KIRKWOOD || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:24 +04:00
depends on OF
help
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:26 +04:00
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
thermal: dove: allow compile test Adding COMPILE_TEST flag to dove driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:45:25 +03:00
depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:26 +04:00
depends on OF
help
Support for the Dove thermal sensor driver in the Linux thermal
framework.
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 14:56:42 +04:00
config DB8500_THERMAL
thermal: allow u8500-thermal driver to be a module When the thermal subsystem is a loadable module, the u8500 driver fails to build: drivers/thermal/built-in.o: In function `db8500_thermal_probe': db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register' drivers/thermal/built-in.o: In function `db8500_thermal_work': db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-25 19:44:12 +03:00
tristate "DB8500 thermal management"
thermal: db8500: Finalize device tree conversion At some point there was an attempt to convert the DB8500 thermal sensor to device tree: a probe path was added and the device tree was augmented for the Snowball board. The switchover was never completed: instead the thermal devices came from from the PRCMU MFD device and the probe on the Snowball was confused as another set of configuration appeared from the device tree. Move over to a device-tree only approach, as we fixed up the device trees. Cc: Vincent Guittot <vincent.guittot@linaro.org> Acked-by: Lee Jones <lee.jones@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-08-28 16:03:18 +03:00
depends on MFD_DB8500_PRCMU && OF
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 14:56:42 +04:00
default y
help
Adds DB8500 thermal management implementation according to the thermal
management framework. A thermal zone with several trip points will be
created. Cooling devices can be bound to the trip points to cool this
thermal zone if trip points reached.
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 05:37:41 +04:00
config ARMADA_THERMAL
thermal: armada: Update Kconfig and module description Update Armada thermal driver Kconfig entry as well as the driver's MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported, eg. Armada 7K and Armada 8K. Use the generic term "Marvell EBU Armada SoCs" instead of listing all the supported SoCs everywhere (excepted in the Kconfig description, where it is useful to have a list). Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-12-22 19:14:10 +03:00
tristate "Marvell EBU Armada SoCs thermal management"
thermal: armada: allow compile test Adding COMPILE_TEST flag to armada driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:48:00 +03:00
depends on ARCH_MVEBU || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 05:37:41 +04:00
depends on OF
help
Enable this option if you want to have support for thermal management
thermal: armada: Update Kconfig and module description Update Armada thermal driver Kconfig entry as well as the driver's MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported, eg. Armada 7K and Armada 8K. Use the generic term "Marvell EBU Armada SoCs" instead of listing all the supported SoCs everywhere (excepted in the Kconfig description, where it is useful to have a list). Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-12-22 19:14:10 +03:00
controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 05:37:41 +04:00
thermal: da9062/61: Thermal junction temperature monitoring driver Add junction temperature monitoring supervisor device driver, compatible with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added. If the PMIC's internal junction temperature rises above T_WARN (125 degC) an interrupt is issued. This T_WARN level is defined as the THERMAL_TRIP_HOT trip-wire inside the device driver. The thermal triggering mechanism is interrupt based and happens when the temperature rises above a given threshold level. The component cannot return an exact temperature, it only has knowledge if the temperature is above or below a given threshold value. A status bit must be polled to detect when the temperature falls below that threshold level again. A kernel work queue is configured to repeatedly poll and detect when the temperature falls below this trip-wire, between 1 and 10 second intervals (defaulting at 3 seconds). This scheme is provided as an example. It would be expected that any final implementation will also include a notify() function and any of these settings could be altered to match the application where appropriate. When over-temperature is reached, the interrupt from the DA9061/2 will be repeatedly triggered. The IRQ is therefore disabled when the first over-temperature event happens and the status bit is polled using a work-queue until it becomes false. This strategy is designed to allow the periodic transmission of uevents (HOT trip point) as the first level of temperature supervision method. It is intended for non-invasive temperature control, where the necessary measures for cooling the system down are left to the host software. Once the temperature falls again, the IRQ is re-enabled so a new critical over-temperature event can be detected. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-28 17:43:33 +03:00
config DA9062_THERMAL
tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
depends on MFD_DA9062 || COMPILE_TEST
depends on OF
help
Enable this for the Dialog Semiconductor thermal sensor driver.
This will report PMIC junction over-temperature for one thermal trip
zone.
Compatible with the DA9062 and DA9061 PMICs.
thermal/drivers/mediatek: Relocate driver to mediatek folder Add MediaTek proprietary folder to upstream more thermal zone and cooler drivers, relocate the original thermal controller driver to it, and rename it as "auxadc_thermal.c" to show its purpose more clearly. Signed-off-by: Balsam CHIHI <bchihi@baylibre.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 13:56:23 +03:00
menu "Mediatek thermal drivers"
depends on ARCH_MEDIATEK || COMPILE_TEST
source "drivers/thermal/mediatek/Kconfig"
endmenu
thermal: Add Mediatek thermal controller support This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-30 14:42:32 +03:00
thermal: amlogic: Add thermal driver to support G12 SoCs Amlogic G12A and G12B SoCs integrate two thermal sensors with the same design. One is located close to the DDR controller and the other one is located close to the PLLs (between the CPU and GPU). The calibration data for each of the thermal sensors instance is stored in a different location within the AO region. Implement reading the temperature from each thermal sensor. The IP block has more functionality, which may be added to this driver in the future: - chip reset when the temperature exceeds a configurable threshold - up to four interrupts when the temperature has risen above a configurable threshold - up to four interrupts when the temperature has fallen below a configurable threshold Tested-by: Christian Hewitt <christianshewitt@gmail.com> Tested-by: Kevin Hilman <khilman@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Guillaume La Roque <glaroque@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
2019-10-04 12:01:09 +03:00
config AMLOGIC_THERMAL
tristate "Amlogic Thermal Support"
default ARCH_MESON
depends on OF && ARCH_MESON
help
If you say yes here you get support for Amlogic Thermal
for G12 SoC Family.
This driver can also be built as a module. If so, the module will
be called amlogic_thermal.
drivers: thermal: Move various drivers for intel platforms into a subdir This cleans up the directory a bit, now that we have several other platforms using platform-specific sub-directories. Compile-tested with ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 09:55:26 +03:00
menu "Intel thermal drivers"
depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
source "drivers/thermal/intel/Kconfig"
endmenu
thermal: broadcom: add Northstar thermal driver Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-03 18:48:29 +03:00
menu "Broadcom thermal drivers"
thermal: broadcom: Add Stingray thermal driver Stingray SoC has six temperature sensor and those are configured, controlled and accessed to read temperature and update in DDR memory using m0 firmware. All six sensors has been given 4 bytes of memory in DDR to write temperature in millivolts. This thermal driver read temperature values from DDR because no direct access to sensors. Like this all temparature sensors are monitored and trips at critical temperature. If driver can't handle thermal runaways because of any unknown reason, then firmware in m0 Processor will handle. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-03 11:55:33 +03:00
depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
COMPILE_TEST
thermal: broadcom: add Northstar thermal driver Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-03 18:48:29 +03:00
source "drivers/thermal/broadcom/Kconfig"
endmenu
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 19:46:00 +04:00
menu "Texas Instruments thermal drivers"
thermal: ti-soc: Kconfig fix to avoid menu showing wrongly Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 07:13:41 +03:00
depends on ARCH_HAS_BANDGAP || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 04:03:59 +03:00
depends on HAS_IOMEM
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 19:46:00 +04:00
source "drivers/thermal/ti-soc-thermal/Kconfig"
endmenu
Merge branch 'cpu-package-thermal' of .git into next Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
2013-06-18 02:31:26 +04:00
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:50:22 +04:00
menu "Samsung thermal drivers"
thermal: exynos: allow compile test Adding COMPILE_TEST flag to exynos driver to facilitate maintenance. Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 06:53:35 +03:00
depends on ARCH_EXYNOS || COMPILE_TEST
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:50:22 +04:00
source "drivers/thermal/samsung/Kconfig"
endmenu
thermal: sti: Introduce ST Thermal core code This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-06-05 19:06:55 +04:00
menu "STMicroelectronics thermal drivers"
thermal: add stm32 thermal driver Add support for DTS thermal sensor that can be found on some STM32 platforms. This driver is based on OF and works in interrupt mode. It offers two temperature trip points: passive and critical. The first is intended for passive cooling notification while the second is used for over-temperature reset. Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-05 13:08:46 +03:00
depends on (ARCH_STI || ARCH_STM32) && OF
thermal: sti: Introduce ST Thermal core code This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-06-05 19:06:55 +04:00
source "drivers/thermal/st/Kconfig"
endmenu
thermal: tegra: move tegra thermal files into tegra directory Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-29 13:29:11 +03:00
source "drivers/thermal/tegra/Kconfig"
thermal: generic-adc: Add ADC based thermal sensor driver In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron <jic23@kernel.org> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-19 10:22:01 +03:00
config GENERIC_ADC_THERMAL
tristate "Generic ADC based thermal sensor"
depends on IIO
help
This enabled a thermal sysfs driver for the temperature sensor
which is connected to the General Purpose ADC. The ADC channel
is read via IIO framework and the channel information is provided
to this driver. This driver reports the temperature by reading ADC
channel and converts it to temperature based on lookup table.
thermal: qcom: tsens: Add a skeletal TSENS drivers TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-05-05 11:51:39 +03:00
menu "Qualcomm thermal drivers"
depends on (ARCH_QCOM && OF) || COMPILE_TEST
source "drivers/thermal/qcom/Kconfig"
endmenu
thermal: uniphier: add UniPhier thermal driver Add a thermal driver for on-chip PVT (Process, Voltage and Temperature) monitoring unit implemented on UniPhier SoCs. This driver supports temperature monitoring and alert function. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-01 11:04:51 +03:00
config UNIPHIER_THERMAL
tristate "Socionext UniPhier thermal driver"
depends on ARCH_UNIPHIER || COMPILE_TEST
depends on THERMAL_OF && MFD_SYSCON
help
Enable this to plug in UniPhier on-chip PVT thermal driver into the
thermal framework. The driver supports CPU thermal zone temperature
reporting and a couple of trip points.
thermal: sprd: Add Spreadtrum thermal driver support This patch adds the support for Spreadtrum thermal sensor controller, which can support maximum 8 sensors. Signed-off-by: Freeman Liu <freeman.liu@unisoc.com> Co-developed-with: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
2020-02-18 11:10:28 +03:00
config SPRD_THERMAL
tristate "Temperature sensor on Spreadtrum SoCs"
depends on ARCH_SPRD || COMPILE_TEST
help
Support for the Spreadtrum thermal sensor driver in the Linux thermal
framework.
thermal: Add support for the MCU controlled FAN on Khadas boards The new Khadas VIM2 and VIM3 boards controls the cooling fan via the on-board microcontroller. This implements the FAN control as thermal devices and as cell of the Khadas MCU MFD driver. Signed-off-by: Neil Armstrong <narmstrong@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2020-06-24 19:15:27 +03:00
config KHADAS_MCU_FAN_THERMAL
tristate "Khadas MCU controller FAN cooling support"
thermal: Drop obsolete dependency on COMPILE_TEST Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. It is actually better to always build such drivers with OF enabled, so that the test builds are closer to how each driver will actually be built on its intended target. Building them without OF may not test much as the compiler will optimize out potentially large parts of the code. In the worst case, this could even pop false positive warnings. Dropping COMPILE_TEST here improves the quality of our testing and avoids wasting time on non-existent issues. Signed-off-by: Jean Delvare <jdelvare@suse.de> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-31 15:13:52 +03:00
depends on OF
thermal: Add support for the MCU controlled FAN on Khadas boards The new Khadas VIM2 and VIM3 boards controls the cooling fan via the on-board microcontroller. This implements the FAN control as thermal devices and as cell of the Khadas MCU MFD driver. Signed-off-by: Neil Armstrong <narmstrong@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2020-06-24 19:15:27 +03:00
depends on MFD_KHADAS_MCU
select MFD_CORE
select REGMAP
help
If you say yes here you get support for the FAN controlled
by the Microcontroller found on the Khadas VIM boards.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 05:16:20 +04:00
endif
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