thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
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@ -122,7 +122,7 @@ err_out:
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*/
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static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
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{
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int pkgid = topology_logical_package_id(cpu);
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int pkgid = topology_logical_die_id(cpu);
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if (pkgid >= 0 && pkgid < max_packages)
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return packages[pkgid];
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@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
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static int pkg_temp_thermal_device_add(unsigned int cpu)
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{
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int pkgid = topology_logical_package_id(cpu);
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int pkgid = topology_logical_die_id(cpu);
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u32 tj_max, eax, ebx, ecx, edx;
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struct pkg_device *pkgdev;
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int thres_count, err;
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@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
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* worker will see the package anymore.
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*/
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if (lastcpu) {
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packages[topology_logical_package_id(cpu)] = NULL;
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packages[topology_logical_die_id(cpu)] = NULL;
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/* After this point nothing touches the MSR anymore. */
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wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
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pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
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@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
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if (!x86_match_cpu(pkg_temp_thermal_ids))
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return -ENODEV;
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max_packages = topology_max_packages();
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max_packages = topology_max_packages() * topology_max_die_per_package();
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packages = kcalloc(max_packages, sizeof(struct pkg_device *),
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GFP_KERNEL);
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if (!packages)
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