dt-bindings: iio: temperature: Add support for tmp006

Add devicetree binding document for TMP006, IR thermopile sensor.

Signed-off-by: Anup Sharma <anupnewsmail@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/3bbda3b1402a26cdafc95c7685679f2311365cad.1684579603.git.anupnewsmail@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
This commit is contained in:
Anup Sharma 2023-05-20 16:23:07 +05:30 committed by Jonathan Cameron
parent 8ff55fe553
commit 7ad78a4074

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# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
%YAML 1.2
---
$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: TI TMP006 IR thermopile sensor
maintainers:
- Peter Meerwald <pmeerw@pmeerw.net>
description: |
TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
properties:
compatible:
const: ti,tmp006
reg:
maxItems: 1
vdd-supply:
description: provide VDD power to the sensor.
required:
- compatible
- reg
additionalProperties: false
examples:
- |
i2c {
#address-cells = <1>;
#size-cells = <0>;
temperature-sensor@40 {
compatible = "ti,tmp006";
reg = <0x40>;
vdd-supply = <&ldo4_reg>;
};
};