dt-bindings: iio: temperature: Add support for tmp006
Add devicetree binding document for TMP006, IR thermopile sensor. Signed-off-by: Anup Sharma <anupnewsmail@gmail.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/3bbda3b1402a26cdafc95c7685679f2311365cad.1684579603.git.anupnewsmail@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: TI TMP006 IR thermopile sensor
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maintainers:
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- Peter Meerwald <pmeerw@pmeerw.net>
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description: |
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TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
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https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
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properties:
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compatible:
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const: ti,tmp006
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reg:
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maxItems: 1
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vdd-supply:
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description: provide VDD power to the sensor.
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required:
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- compatible
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- reg
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additionalProperties: false
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examples:
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- |
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i2c {
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#address-cells = <1>;
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#size-cells = <0>;
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temperature-sensor@40 {
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compatible = "ti,tmp006";
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reg = <0x40>;
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vdd-supply = <&ldo4_reg>;
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};
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};
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