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Add the DT info for SAR ADC of the Amlogic's Meson-AXG SoC.
Signed-off-by: Xingyu Chen <xingyu.chen@amlogic.com>
Signed-off-by: Yixun Lan <yixun.lan@amlogic.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The Amlogic P241 board is the Reference Design board for the S805X
variant of the Amlogic Meson GXL SoC family.
The P241 board has the following features :
- 1GiB DDR4 Memory
- HDMI Connector with CEC
- A/V jack with Stereo Audio and CVBS
- 10/100 Ethernet
- 2x USB2.0 Type-A
- On-board WiFi SDIO Module
- On-board eMMC storage
- Infraread Received
- Factory Reset button
- UART connector
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
[khilman: s/arm64/ARM64/ in Subject]
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Add the different pin configurations for the spdif output
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Add the first of the two tas5707 power amplifier present on the
speaker daughter board.
According to the schematics of the S400 v3, only I2SB_DIN3 and
I2SC_DOUT2 will be available to the speaker board.
9R83, 9R84 and 9R18 are not connected so no audio signal will be
provided to the second amplifier. There is no point in enabling it
even if it is visible on the i2c bus.
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Add a fixed regulator for the main 12v which is the main power supply
of the board.
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The microphone card connected to the s400 has 6 leds controlled
through an additional i2c gpio controller.
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The Amlogic Meson GXBB based Nanopi-K2 board has an HDMI connector
with CEC and CVBS available on the 40pin header.
This patch adds the nodes to enable HDMI, CEC and CVBS functionnalities.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
meson-gx-p23x-q20x.dtsi is currently used by five boards:
- Amlogic P230 and P231 (which should be identical, apart from the
external RGMII PHY on P230 whereas P231 can only use the internal PHY)
- Amlogic Q200 (identical to P230 but with an S912 GXM SoC instead of a
GXL S905D SoC) and Q201 (identical to P231 but with an S912 GXM SoC
instead of a GXL S905D SoC)
- NEXBOX A1 (based on the S912 GXM SoC)
The Amlogic P230 board uses a Broadcom BCM4356 SDIO wifi chip. Since the
other Amlogic reference design boards are very similar it's safe to
assume that these also use a Broadcom based SDIO wifi chip (which is
also how it was configured in meson-gx-p23x-q20x.dtsi).
However, NEXBOX A1 comes with a "longsys LTM8830" SDIO wifi module,
which is based on the "Qualcomm Atheros QCA9377-3(QCA1023-0)" chipset.
Thus move the wifi node from meson-gx-p23x-q20x.dtsi to each of the
four Amlogic reference board's .dts files.
There are no devicetree bindings for the QCA9377 SDIO wifi module yet,
so nothing is added to meson-gxm-nexbox-a1.dts.
Fixes: f51b454549b812 ("ARM64: dts: meson-gxm: Add support for the Nexbox A1")
Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
meson-gxl-s905d-p230.dts and meson-gxm-q200.dts enable the saradc node
(and configure it's vref-supply "VDDIO_AO18") in their corresponding
.dts file.
Move both (the saradc node as well as the VDDIO_AO18 regulator) to
remove some duplicate code.
As a positive side-effect this enables the saradc also for the P231 (GXL
S905D) and Q201 (GXM S912) development boards which are similar to the
P230/Q200 boards (P231 and Q201 use the internal 100Mbit/s PHY, while
P230 and Q200 have an external RGMII PHY).
Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Describe the INTC-EX interrupt controller in the R8A77980 device tree.
Based on the original (and large) patch by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds and USB3.0 host device node and enable it for
R-Car E3 Ebisu board.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the device nodes for SCIF {0,1,3,4,5} and all HSCIF serial
ports, incl. clocks, power domain and DMAs.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Ulrich Hecht <ulrich.hecht+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
arm64: dts: add ufs node for Hisilicon.
Signed-off-by: Li Wei <liwei213@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Tested-by: John Stultz <john.stultz@linaro.org>
Acked-by: Wei Xu <xuwei5@hisilicon.com>
Signed-off-by: Martin K. Petersen <martin.petersen@oracle.com>
The Pine H64 board have a MicroSD slot connected to MMC0 controller of
the H6 SoC and a eMMC slot connected to MMC2.
Enable them in the device tree.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
The Allwinner H6 SoC have 3 MMC controllers.
Add device tree nodes for them.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
address-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
This patch fix the following DT warning:
Warning (avoid_unnecessary_addr_size): /soc/ethernet@1c50000: unnecessary #address-cells/#size-cells without "ranges" or child "reg" property
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
Avnet Ultra96 rev1 board is commercialized Xilinx zcu100 revC/D
internal board. The patch is reusing zcu100 revC files but changing
model description and compatible strings which are used for example by
libmraa.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
dts reports incorrect usage of these properties in gpio-keys node.
Warning (avoid_unnecessary_addr_size): /gpio-keys: unnecessary
The patch is removing these useless properties.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Mainline started to use serdev interface for uart attached devices.
Change description to reflect it.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
This patch adds GPIO for headphone detection on LD11 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
This patch adds GPIO for headphone detection on LD20 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The EValuation Module(EVM) platform for AM654 consists of a
common Base board + one or more of daughter cards, which include:
a) "Personality Modules", which can be specific to a profile, such as
ICSSG enabled or Multi-media (including audio).
b) SERDES modules, which may be 2 lane PCIe or two port PCIe + USB2
c) Camera daughter card
d) various display panels
Among other options. There are two basic configurations defined which
include an "EVM" configuration and "IDK" (Industrial development kit)
which differ in the specific combination of daughter cards that are
used.
To simplify support, we choose to support just the base board as the
core device tree file and all daughter cards would be expected to be
device tree overlays.
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
The AM654 SoC is a lead device of the K3 Multicore SoC architecture
platform, targeted for broad market and industrial control with aim to
meet the complex processing needs of modern embedded products.
Some highlights of this SoC are:
* Quad ARMv8 A53 cores split over two clusters
* GICv3 compliant GIC500
* Configurable L3 Cache and IO-coherent architecture
* Dual lock-step capable R5F uC for safety-critical applications
* High data throughput capable distributed DMA architecture under NAVSS
* Three Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
* Centralized System Controller for Security, Power, and Resource
management.
* Dual ADCSS, eQEP/eCAP, eHRPWM, dual CAN-FD
* Flash subsystem with OSPI and Hyperbus interfaces
* Multimedia capability with CAL, DSS7-UL, SGX544, McASP
* Peripheral connectivity including USB3, PCIE, MMC/SD, GPMC, I2C, SPI,
GPIO
See AM65x Technical Reference Manual (SPRUID7, April 2018)
for further details: http://www.ti.com/lit/pdf/spruid7
NOTE:
1. AM654 is the first of the device variants, hence we introduce a
generic am65.dtsi.
2. We indicate the proper bus topology, the ranges are elaborated in
each bus segment instead of using the top level ranges to make sure
that peripherals in each segment use the address space accurately.
3. Peripherals in each bus segment is maintained in a separate dtsi
allowing for reuse in different bus segment representation from a
different core such as R5. This is also the reason for maintaining a
1-1 address map in the ranges.
4. Cache descriptions follow the ARM64 standard description.
Further tweaks may be necessary as we introduce more complex devices,
but can be introduced in context of the device introduction.
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Benjamin Fair <b-fair@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
The vDSO needs to have a unique build id in a similar manner
to the kernel and modules. Use the build salt macro.
Acked-by: Will Deacon <will.deacon@arm.com>
Signed-off-by: Laura Abbott <labbott@redhat.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Do minor rearrangement as well to keep ordering consistent.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Update entry/exit latency and residency time of hikey960 to use more
realistic figures based on unitary tests done on the platform.
The complete results (in us) :
big cluster
cluster CPU
max entry latency 800 400
max exit latency 2900 550
residency 903Mhz 5000 1500
residency 2363Mhz 0 1500
little cluster
cluster CPU
max entry latency 500 400
max exit latency 1600 650
residency 533Mhz 8000 4500
residency 1844Mhz 0 1500
We can see that the residency time depends of the running OPP which is not
handled for now. Then we also have to take into account the constraint of
a residency time shorter than the tick to get full advantage of idle loop
reordering(tick is stopped if idle duration is higher than tick period).
Finally the selected residency value are :
big cluster
cluster CPU
residency 3700 1500
little cluster
cluster CPU
residency 3500 1500
A simple test with a task waking up every 11.111ms shows improvement:
- 5% a lowest OPP
- 22% at highest OPP
The period has been chosen:
- to be shorter than old cluster residency time and longer than new
residency time of cluster off C-state
- to prevent any sync with tick (4ms) when running tests that can add
some variances between tests
Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Remove the keep-power-in-suspend property because it keeps wifi power
on during suspend. This property is only required when enabling WoWLAN
and should only be enabled based on need.
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Remove the keep-power-in-suspend property because it keeps wifi power
on during suspend. This property is only required when enabling WoWLAN
and should only be enabled based on need. Also remove dupplicate property
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Certain properties should be moved to the board file to reflect
the specific properties of the board, and not the SoC. Move these
properties to proper location and organize properties in both files.
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
The input clock of UART0 should be CLK_PERI_UART0_PD.
Fixes: 13f36c326cef ("arm64: dts: mt7622: turn uart0 clock to real ones")
Signed-off-by: Ryder Lee <ryder.lee@mediatek.com>
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
Pine H64 board has an AXP805 PMIC on it, wired up in standalone, or
self-working, mode.
Enable it in the device tree.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Reviewed-by: Icenowy Zheng <icenowy@aosc.io>
Tested-by: Icenowy Zheng <icenowy@aosc.io>
Acked-by: Maxime Ripard <maxime.ripard@bootlin.com>
Signed-off-by: Chen-Yu Tsai <wens@csie.org>
Now that the device tree binding headers for the R_CCU have been merged,
we can use the macros, instead of raw numbers.
Switch to R_CCU macros for clock and reset indices.
Reviewed-by: Icenowy Zheng <icenowy@aosc.io>
Tested-by: Icenowy Zheng <icenowy@aosc.io>
Acked-by: Maxime Ripard <maxime.ripard@bootlin.com>
Signed-off-by: Chen-Yu Tsai <wens@csie.org>
The pwm-regulator for vdd_log uses additional unreviewed properties in the
vendor kernel, which slipped in with the devicetree.
As written, they are unreviewed and unused in all mainline implementations
so drop them again.
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
The vcc3v3_pcie regulator supplies 3.3V so add voltage properties
for it.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
[split off from original patch]
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
The board exposes two types A ports, one is USB 3.0, up to 5.0Gbps and
another one is USB 2.0 up to 480Mbps. Enable the USB PHYs and the USB
controllers to enable theses devices.
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Add earlycon to mt7622-rfb1 as to know what was going on when a certain
fault is happening at the early initialization stage.
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
Using gpio-ranges property represent which GPIOs correspond to which pins
on MT7622 pin controllers. For details, we can see section 2.1 of
Documentation/devicetree/bindings/gpio/gpio.txt to know how to bind pinctrl
and gpio drivers via the "gpio-ranges" property.
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
Add IPMMU device nodes for the R-Car M3-N (r8a77965),
V3H (r8a77980) and E3 (r8a77990) SoCs.
* The r8a77965 IPMMU is quite similar to r8a7796 however VP0
has been added and PV1 has been removed. Also the IMSSTR
bit assignment has been reworked.
* The r8a77980 IPMMU is quite similar to r8a77970 however VC0
has been added. The IMSSTR bit assignment has also been
reworked. Power domains are also quite different however the
the documentation is rather unclear about this topic.
Until we know better VC0 gets assigned to R8A77980_PD_ALWAYS_ON.
* The r8a77990 IPMMU is similar to r8a77995. Power domains are
however different and the public documentation is still unclear.
Based on preliminary information from the hardware team the R-Car E3
SoC comes with an IPMMU-VP0 device in an Always-on power domain and
the IPMMU-VC0 is placed as expected in the A3VC power domain.
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Armada 3700
- Add default memory reservation for ATF
- Add a node for AVS support
Fix eth3 connector name on the Macchiatobin
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Merge tag 'mvebu-dt64-4.19-1' of git://git.infradead.org/linux-mvebu into next/dt
mvebu dt64 for 4.19 (part 1)
Armada 3700
- Add default memory reservation for ATF
- Add a node for AVS support
Fix eth3 connector name on the Macchiatobin
* tag 'mvebu-dt64-4.19-1' of git://git.infradead.org/linux-mvebu:
arm64: dts: marvell: armada-37xx: reserve memory for ATF
arm64: dts: marvell: armada-37xx: add the node allowing AVS support
arm64: dts: marvell: mcbin: fix eth3 connector name
Signed-off-by: Olof Johansson <olof@lixom.net>
Cleanup from old properties and code-style warnings.
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Merge tag 'samsung-dt64-4.19' of https://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux into next/dt
Samsung DTS ARM64 changes for v4.19
Cleanup from old properties and code-style warnings.
* tag 'samsung-dt64-4.19' of https://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux:
arm64: dts: exynos: Remove leading 0x from unit addresses in Exynos5433
arm64: dts: exynos: Remove no longer needed samsung thermal properties
Signed-off-by: Olof Johansson <olof@lixom.net>
