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CoreSight DT bindings have been updated, thus the old compatible strings
are obsolete and the drivers will report warning if DTS uses these
obsolete strings.
This patch switches to the new bindings for CoreSight dynamic funnel,
so can dismiss warning during initialisation.
Cc: Andy Gross <agross@kernel.org>
Cc: David Brown <david.brown@linaro.org>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Suzuki K Poulose <suzuki.poulose@arm.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Andy Gross <agross@kernel.org>
Some ISDN files that got removed in net-next had some changes
done in mainline, take the removals.
Signed-off-by: David S. Miller <davem@davemloft.net>
Because of register and bits difference for setting PHY modes, PTP reference
clock, and FPGA signalling, the Stratix10 SoC needs to use the
"altr,socfpga-stmmac-a10-s10" binding to set the correct modes.
On Stratix10, each EMAC has its own register for PHY modes, and they all have
the same offset, thus we can use the 2nd parameter to specify the offsets
for the FPGA signal bits.
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds pincontrol support to scif2/scif clock.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the HiHope RZ/G2M main board:
- Memory,
- Main crystal,
- Serial console
This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.
The operating points for the cluster with the A57s are:
Frequency | Voltage
-----------|---------
500 MHz | 0.82V
1.0 GHz | 0.82V
1.5 GHz | 0.82V
The operating points for the cluster with the A53s are:
Frequency | Voltage
-----------|---------
800 MHz | 0.82V
1.0 GHz | 0.82V
1.2 GHz | 0.82V
This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A5 cooling device supports 5 cooling states which can be categorised as
follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec22 ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.
As per 87c059e9c39d ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:
Steps to reproduce:
- start AVB TX stream (Using aplay via MSE),
- disconnect+reconnect the eth cable,
- after a reconnection the eth connection goes iteratively up/down
without user interaction,
- this may heal after some seconds or even stay for minutes.
As the documentation specifies, the "renesas,no-ether-link" option
should be used when a board does not provide a proper AVB_LINK signal.
There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
and ULCB starter kits since the AVB_LINK is correctly handled by HW.
Choosing to keep or remove the "renesas,no-ether-link" option will have
impact on the code flow in the following ways:
- keeping this option enabled may lead to unexpected behavior since the
RX & TX are enabled/disabled directly from adjust_link function
without any HW interrogation,
- removing this option, the RX & TX will only be enabled/disabled after
HW interrogation. The HW check is made through the LMON pin in PSR
register which specifies AVB_LINK signal value (0 - at low level;
1 - at high level).
In conclusion, the present change is also a safety improvement because
it removes the "renesas,no-ether-link" option leading to a proper way
of detecting the link state based on HW interrogation and not on
software heuristic.
Fixes: 8441ef643d7d ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Apparently this DTS crossed over with commit 31af04cd60d3 ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Convert bootargs from ip=dhcp to ip=on
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
GIC is inside of SoC from architecture perspective, it should
be located inside of soc node in DT.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Based on 2 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
publishhed by the free software foundation
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 48 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000436.292339952@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 and
only version 2 as published by the free software foundation this
program is distributed in the hope that it will be useful but
without any warranty without even the implied warranty of
merchantability or fitness for a particular purpose see the gnu
general public license for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 294 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.825281744@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
usbphy nodes do not have any register properties and thus
shouldn't be placed inside the bus.
Move usbphy nodes from soc node to root node in order to fix
the following build warnings with W=1:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:681.27-687.6: Warning (simple_bus_reg): /soc/bus@32c00000/usbphynop1: missing or empty reg/ranges property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:710.27-716.6: Warning (simple_bus_reg): /soc/bus@32c00000/usbphynop2: missing or empty reg/ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Pass the 'ranges' property for each one of the AIPS bus in order
to fix the following build warnings:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:209.23-388.5: Warning (unit_address_vs_reg): /soc/bus@30000000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:390.23-439.5: Warning (unit_address_vs_reg): /soc/bus@30400000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:441.23-658.5: Warning (unit_address_vs_reg): /soc/bus@30800000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:660.23-724.5: Warning (unit_address_vs_reg): /soc/bus@32c00000: node has a unit name, but
no reg property
This also aligns with imx8mq.dtsi.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
The 'soc' name needs a unit name to match its 'ranges' property.
Pass the unit name in order to fix the following dtc build warning
with W=1:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:203.6-754.4: Warning (unit_address_vs_reg): /soc: node has a reg or ranges property, but no unit name
This also aligns with imx8mq.dtsi.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Add a node for the snvs power key, "disabled" by default.
Signed-off-by: Angus Ainslie (Purism) <angus@akkea.ca>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Two of the Tegra I2C controllers share pads with the DPAUX controllers.
In order for the I2C controllers to use these pads, they have to be set
into I2C mode. Use the I2C and off pin control states defined in the DT
nodes for DPAUX as "default" and "idle" states, respectively. This
ensures that the I2C controller driver can properly configure the pins
when it needs to perform I2C transactions.
Acked-by: Jon Hunter <jonathanh@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Tegra186 has two CPU clusters with its own cache hierarchy. This patch
adds them with the cache information of each of the CPUs.
Signed-off-by: Joseph Lo <josephl@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
The GPIO expanders on Jetson TX2 are powered by the VDD_1V8 and
VDD_3V3_SYS supplies, respectively. Model this in device tree so that
the correct supplies are referenced.
Reviewed-by: Jon Hunter <jonathanh@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
ls1028a platform uses sp805 watchdog, and use 1/16 platform clock as
timer clock, this patch fix device tree node.
Signed-off-by: Chuanhua Han <chuanhua.han@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
i.MX system controller watchdog has pretimeout function which
depends on i.MX SCU driver, so it should be a subnode of SCU.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Rock Pi 4 has a on board AP6256 WiFi/BT Module. enable wifi and bluetooth
support on Rock Pi 4 board.
Signed-off-by: Akash Gajjar <akash@openedev.com>
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
isp iommu requires wrapper variants of the clocks.
noc variants are always on and using the wrapper variants will activate
{A,H}CLK_ISP{0,1} due to the hierarchy.
Tested using the pending isp patch set (which is not upstream
yet). Without this patch, streaming from the isp stalls.
Also add the respective power domain and remove the "disabled" status.
Refer:
RK3399 TRM v1.4 Fig. 2-4 RK3399 Clock Architecture Diagram
RK3399 TRM v1.4 Fig. 8-1 RK3399 Power Domain Partition
Signed-off-by: Helen Koike <helen.koike@collabora.com>
Tested-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Enlarge the SGMII register range and using 2.5G force mode on default.
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
The manufacturer of this board, ships it with various SPI NOR chips and
increments U-Boot bootloader version along the time. There is no way to
tell which is placed on the board since no revision bump takes place.
This creates two issues.
The first, cosmetic. Since the NOR chip may differ, there's message on
boot stating that kernel expected w25q32dw and found different one. To
correct this, remove optional device-specific compatible string. Being
here lets replace bogus "spi-flash" compatible string with proper one.
The second is linked to partitions layout, it changed after commit:
81e7251252 ("arm64: mvebu: config: move env to the end of the 4MB boot
device") in Marvells downstream U-Boot fork [1], shifting environment
location to the end of boot device. Since the new boards will have U-Boot
with this change, it'll lead to improper results writing or reading from
these partitions. We can't tell if users will update bootloader to recent
version provided on manufacturer website, so lets drop partitons layout.
1. https://github.com/MarvellEmbeddedProcessors/u-boot-marvell.git
Signed-off-by: Tomasz Maciej Nowak <tmn505@gmail.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
While AP I2C bus was available to users in early revisions of the SoC,
this is not the case anymore since eMMC was connected to the AP. Most
users do not have access to this I2C bus so do not enable it in the
board device tree.
As there are three I2C buses enabled on this board, add an alias to be
sure the two other buses keep their initial numbering.
Signed-off-by: Konstantin Porotchkin <kostap@marvell.com>
[<miquel.raynal@bootlin.com>: Reword commit message, add alias]
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Avoid critical temperatures in the AP806 by adding the relevant trip
points/cooling-maps using CPUfreq as cooling device.
So far, when the temperature reaches 100°C in the thermal IP of the
AP806 (close enough from the 2/4 cores) an overheat interrupt is
raised. The thermal core then shutdowns the system to avoid damaging
the hardware.
Adding CPUfreq as a cooling device could help avoiding such very
critical situation. For that, we enable thermal throttling by
defining, for each CPU, two trip points with the corresponding cooling
'intensity'. CPU0 and CPU1 are in the same cluster and are driven by
the same clock. Same applies for CPU2 and CPU3, if available. So
changing the frequency of one will also change the frequency of the
other one, hence the use of two cooling devices per core.
The heat map is as follow:
- Below 85°C: the cluster runs at the highest frequency
(e.g: 1200MHz).
- Between 85°C and 95°C: there are two trip points at half
(e.g: 600MHz) and a third (e.g: 400MHz) of the highest frequency.
- Above 95°C the cluster runs at a quarter of the highest frequency
(e.g: 300MHz).
- At 100°C the platform is shutdown.
Suggested-by: Omri Itach <omrii@marvell.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
When adding thermal nodes, the CPUs have been named from 1 to 4 while
usually everywhere else they are referred as 0-3. Let's change this to
be consistent with later changes when we will use CPUfreq and CPU
phandles as cooling devices to avoid inconsistencies in the nodes
numbering.
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
The Clearfog GT-8K board is capable of supplying power up to 2W to SFP
modules. Make that explicit in the device-tree. Without this property
current kernel does not allow SFP modules that require more than 1W.
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Running a graphics adapter on the MACCHIATObin fails due to an
insufficiently sized memory window.
Enlarge the memory window for the PCIe slot to 512 MiB.
With the patch I am able to use a GT710 graphics adapter with 1 GB onboard
memory.
These are the mapped memory areas that the graphics adapter is actually
using:
Region 0: Memory at cc000000 (32-bit, non-prefetchable) [size=16M]
Region 1: Memory at c0000000 (64-bit, prefetchable) [size=128M]
Region 3: Memory at c8000000 (64-bit, prefetchable) [size=32M]
Region 5: I/O ports at 1000 [size=128]
Expansion ROM at ca000000 [disabled] [size=512K]
Signed-off-by: Heinrich Schuchardt <xypron.glpk@gmx.de>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
i.MX8MM has 5 SAI instances with the following base
addresses according to RM.
SAI1 base address: 3001_0000h
SAI2 base address: 3002_0000h
SAI3 base address: 3003_0000h
SAI5 base address: 3005_0000h
SAI6 base address: 3006_0000h
Signed-off-by: Daniel Baluta <daniel.baluta@nxp.com>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
i.MX8MQ has clock gate for SNVS module, add clock info to SNVS
RTC node for clock management.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms and conditions of the gnu general public license
version 2 as published by the free software foundation this program
is distributed in the hope it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details you should have received a copy of the gnu general
public license along with this program if not see http www gnu org
licenses
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 228 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Reviewed-by: Steve Winslow <swinslow@gmail.com>
Reviewed-by: Richard Fontana <rfontana@redhat.com>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190528171438.107155473@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
published by the free software foundation this program is
distributed in the hope that it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 655 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Richard Fontana <rfontana@redhat.com>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190527070034.575739538@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license as published by
the free software foundation either version 2 of the license or at
your option any later version
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-or-later
has been chosen to replace the boilerplate/reference in 3029 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190527070032.746973796@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Add the rpmpd node on the msm8998 and define the available levels.
Reviewed-by: Jeffrey Hugo <jhugo@codeaurora.org>
Reviewed-by: Vinod Koul <vkoul@kernel.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
[bjorn: dropped use of level defines, to allow merging in parallel]
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Andy Gross <agross@kernel.org>
Add the rpmpd node on the qcs404 and define the available levels.
Reviewed-by: Jeffrey Hugo <jhugo@codeaurora.org>
Reviewed-by: Vinod Koul <vkoul@kernel.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
[sibis: fixup available levels]
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
[bjorn: dropped use of level defines, to allow merging in parallel]
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Andy Gross <agross@kernel.org>
