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This function call was found to be unnecessary as there is no equivalent
platform_get_drvdata() call to access the private data of the driver. Also,
the private data is defined in this driver, so there is no risk of it being
accessed outside of this driver file.
Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com>
Reviewed-by: Alexandru Ardelean <alex@shruggie.ro>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230811191548.3340-1-aboutphysycs@gmail.com
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-23-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Fix up the following warning when compiled with make W=1:
linux.git/drivers/thermal/max77620_thermal.c:48: warning: Function
parameter or member 'temp' not described in 'max77620_thermal_read_temp'
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/c943d51e7913a4b73cda447547b8ee77c857f7ba.1574242756.git.amit.kucheria@linaro.org
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms and conditions of the gnu general public license
version 2 as published by the free software foundation
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 101 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190531190113.822954939@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.
This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.
Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The thermal child device reuses the parent MFD-device device-tree node
when registering a thermal zone, but did not take a reference to the
node.
This leads to a reference imbalance, and potential use-after-free, when
the node reference is dropped by the platform-bus device destructor
(once for the child and later again for the parent).
Fix this by dropping any reference already held to a device-tree node
and getting a reference to the parent's node which will be balanced on
reprobe or on platform-device release, whichever comes first.
Note that simply clearing the of_node pointer on probe errors and on
driver unbind would not allow the use of device-managed resources as
specifically thermal_zone_of_sensor_unregister() claims that a valid
device-tree node pointer is needed during deregistration (even if it
currently does not seem to use it).
Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: stable <stable@vger.kernel.org> # 4.9
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
If the driver is built as a module, autoload won't work because the module
alias information is not filled. So user-space can't match the registered
device with the corresponding module.
Export the module alias information using the MODULE_DEVICE_TABLE() macro.
Before this patch:
$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
$
After this patch:
$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
alias: platform:max77620-thermal
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
