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Add a new PCI driver which register a thermal zone and allows to get
notification for threshold violation by a RW trip point. These
notifications are delivered from the device using MSI based
interrupt.
The main difference between this new PCI driver and the existing
one is that the temperature and trip points directly use PCI
MMIO instead of using ACPI methods.
This driver registers a thermal zone "TCPU_PCI" in addition to the
legacy processor thermal device, which uses ACPI companion device
to set name, temperature and trips.
This driver is enabled for AlderLake.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210525204811.3793651-3-srinivas.pandruvada@linux.intel.com
Remove enumeration part from the processor_thermal_device to two
different modules. One for ACPI and one for PCI:
ACPI enumeration: int3401_thermal
PCI part: processor_thermal_device_pci_legacy
The current processor_thermal_device now just implements interface
functions to be used by the ACPI and PCI enumeration module. This is
done by:
1. Make functions proc_thermal_add() and proc_thermal_remove() non static
and export them for usage in other processor_thermal_device_pci_legacy.c
and in int3401_thermal.c.
2. Move the sysfs file creation for TCC offset and power limit attribute
group to the proc_thermal_add() from the individual enumeration callbacks
for PCI and ACPI.
3. Create new interface functions proc_thermal_mmio_add() and
proc_thermal_mmio_remove() which will be called from the
processor_thermal_device_pci_legacy module.
4. Export proc_thermal_resume(), so that it can be used by power
management callbacks.
5. Remove special check for double enumeration as it never happens.
While here, fix some cleanup on error conditions in proc_thermal_add().
No functional changes are expected with this change.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210525204811.3793651-2-srinivas.pandruvada@linux.intel.com
Fix function name in devfreq_cooling.c comment to remove a
warning found by kernel-doc.
drivers/thermal/devfreq_cooling.c:479: warning: expecting prototype for
devfreq_cooling_em_register_power(). Prototype was for
devfreq_cooling_em_register() instead.
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Reviewed-by: Nick Desaulniers <ndesaulniers@google.com>
Reviewed-by: Nathan Chancellor <nathan@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1623223350-128104-1-git-send-email-yang.lee@linux.alibaba.com
Zone device is enabled after thermal_zone_of_sensor_register() completion,
but it's not disabled before senor is unregistered, leaving temperature
polling active. This results in accessing a disabled zone device and
produces a warning about this problem. Stop zone device before
unregistering it in order to fix this "use-after-free" problem.
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-3-digetx@gmail.com
Early exits from for_each_available_child_of_node() should decrement the
node reference counter. Reported by Coccinelle:
drivers/thermal/sprd_thermal.c:387:1-23: WARNING:
Function "for_each_child_of_node" should have of_node_put() before goto around lines 391.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Chunyan Zhang <zhang.lyra@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210614192230.19248-2-krzysztof.kozlowski@canonical.com
Early exits from for_each_available_child_of_node() should decrement the
node reference counter. Reported by Coccinelle:
drivers/thermal/imx_sc_thermal.c:93:1-33: WARNING:
Function "for_each_available_child_of_node" should have of_node_put() before return around line 97.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210614192230.19248-1-krzysztof.kozlowski@canonical.com
With -Wshadow:
drivers/thermal/rcar_gen3_thermal.c: In function ‘rcar_gen3_thermal_probe’:
drivers/thermal/rcar_gen3_thermal.c:310:13: warning: declaration of ‘rcar_gen3_ths_tj_1’ shadows a global declaration [-Wshadow]
310 | const int *rcar_gen3_ths_tj_1 = of_device_get_match_data(dev);
| ^~~~~~~~~~~~~~~~~~
drivers/thermal/rcar_gen3_thermal.c:246:18: note: shadowed declaration is here
246 | static const int rcar_gen3_ths_tj_1 = 126;
| ^~~~~~~~~~~~~~~~~~
To add to the confusion, the local variable has a different type.
Fix the shadowing by renaming the local variable to ths_tj_1.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/9ea7e65d0331daba96f9a7925cb3d12d2170efb1.1623076804.git.geert+renesas@glider.be
The fixed value of 157 used in the calculations are only correct for
M3-W, on other Gen3 SoC it should be 167. The constant can be derived
correctly from the static TJ_3 constant and the SoC specific TJ_1 value.
Update the calculation be correct on all Gen3 SoCs.
Fixes: 4eb39f79ef44 ("thermal: rcar_gen3_thermal: Update value of Tj_1")
Reported-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210605085211.564909-1-niklas.soderlund+renesas@ragnatech.se
Use devm_platform_get_and_ioremap_resource() to simplify
code and remove error message which within
devm_platform_get_and_ioremap_resource() already.
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210605120205.2459578-1-yangyingliang@huawei.com
Fix the following make W=1 kernel build warning:
drivers/thermal/thermal_core.c:1376: warning: expecting prototype for thermal_device_unregister(). Prototype was for thermal_zone_device_unregister() instead
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210517051020.3463536-1-yangyingliang@huawei.com
Export additional attributes:
ddr_data_rate (RO) : Show current DDR (Double Data Rate) data rate.
rfi_restriction (RW) : Show or set current state for RFI (Radio
Frequency Interference) protection.
These attributes use mailbox commands to get/set information. Here
command codes are:
0x0007: Read RFI restriction
0x0107: Read DDR data rate
0x0008: Write RFI restriction
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210517061441.1921901-3-srinivas.pandruvada@linux.intel.com
MODULE_DEVICE_TABLE is used to extract the device information out of the
driver and builds a table when being compiled. If using this macro,
kernel can find the driver if available when the device is plugged in,
and then loads that driver and initializes the device.
Fixes: 554fdbaf19b18 ("thermal: sprd: Add Spreadtrum thermal driver support")
Signed-off-by: Chunyan Zhang <chunyan.zhang@unisoc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210512093752.243168-1-zhang.lyra@gmail.com
The RK3568 SoCs have two Temperature Sensors, channel 0 is for CPU,
channel 1 is for GPU.
Signed-off-by: Finley Xiao <finley.xiao@rock-chips.com>
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-5-ezequiel@collabora.com
MSR_AMD64_SEV even though the spec clearly states so, and check CPUID
bits first.
- Send only one signal to a task when it is a SEGV_PKUERR si_code type.
- Do away with all the wankery of reserving X amount of memory in
the first megabyte to prevent BIOS corrupting it and simply and
unconditionally reserve the whole first megabyte.
- Make alternatives NOP optimization work at an arbitrary position
within the patched sequence because the compiler can put single-byte
NOPs for alignment anywhere in the sequence (32-bit retpoline), vs our
previous assumption that the NOPs are only appended.
- Force-disable ENQCMD[S] instructions support and remove update_pasid()
because of insufficient protection against FPU state modification in an
interrupt context, among other xstate horrors which are being addressed
at the moment. This one limits the fallout until proper enablement.
- Use cpu_feature_enabled() in the idxd driver so that it can be
build-time disabled through the defines in .../asm/disabled-features.h.
- Fix LVT thermal setup for SMI delivery mode by making sure the APIC
LVT value is read before APIC initialization so that softlockups during
boot do not happen at least on one machine.
- Mark all legacy interrupts as legacy vectors when the IO-APIC is
disabled and when all legacy interrupts are routed through the PIC.
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Merge tag 'x86_urgent_for_v5.13-rc5' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip
Pull x86 fixes from Borislav Petkov:
"A bunch of x86/urgent stuff accumulated for the last two weeks so
lemme unload it to you.
It should be all totally risk-free, of course. :-)
- Fix out-of-spec hardware (1st gen Hygon) which does not implement
MSR_AMD64_SEV even though the spec clearly states so, and check
CPUID bits first.
- Send only one signal to a task when it is a SEGV_PKUERR si_code
type.
- Do away with all the wankery of reserving X amount of memory in the
first megabyte to prevent BIOS corrupting it and simply and
unconditionally reserve the whole first megabyte.
- Make alternatives NOP optimization work at an arbitrary position
within the patched sequence because the compiler can put
single-byte NOPs for alignment anywhere in the sequence (32-bit
retpoline), vs our previous assumption that the NOPs are only
appended.
- Force-disable ENQCMD[S] instructions support and remove
update_pasid() because of insufficient protection against FPU state
modification in an interrupt context, among other xstate horrors
which are being addressed at the moment. This one limits the
fallout until proper enablement.
- Use cpu_feature_enabled() in the idxd driver so that it can be
build-time disabled through the defines in disabled-features.h.
- Fix LVT thermal setup for SMI delivery mode by making sure the APIC
LVT value is read before APIC initialization so that softlockups
during boot do not happen at least on one machine.
- Mark all legacy interrupts as legacy vectors when the IO-APIC is
disabled and when all legacy interrupts are routed through the PIC"
* tag 'x86_urgent_for_v5.13-rc5' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip:
x86/sev: Check SME/SEV support in CPUID first
x86/fault: Don't send SIGSEGV twice on SEGV_PKUERR
x86/setup: Always reserve the first 1M of RAM
x86/alternative: Optimize single-byte NOPs at an arbitrary position
x86/cpufeatures: Force disable X86_FEATURE_ENQCMD and remove update_pasid()
dmaengine: idxd: Use cpu_feature_enabled()
x86/thermal: Fix LVT thermal setup for SMI delivery mode
x86/apic: Mark _all_ legacy interrupts when IO/APIC is missing
There are machines out there with added value crap^WBIOS which provide an
SMI handler for the local APIC thermal sensor interrupt. Out of reset,
the BSP on those machines has something like 0x200 in that APIC register
(timestamps left in because this whole issue is timing sensitive):
[ 0.033858] read lvtthmr: 0x330, val: 0x200
which means:
- bit 16 - the interrupt mask bit is clear and thus that interrupt is enabled
- bits [10:8] have 010b which means SMI delivery mode.
Now, later during boot, when the kernel programs the local APIC, it
soft-disables it temporarily through the spurious vector register:
setup_local_APIC:
...
/*
* If this comes from kexec/kcrash the APIC might be enabled in
* SPIV. Soft disable it before doing further initialization.
*/
value = apic_read(APIC_SPIV);
value &= ~APIC_SPIV_APIC_ENABLED;
apic_write(APIC_SPIV, value);
which means (from the SDM):
"10.4.7.2 Local APIC State After It Has Been Software Disabled
...
* The mask bits for all the LVT entries are set. Attempts to reset these
bits will be ignored."
And this happens too:
[ 0.124111] APIC: Switch to symmetric I/O mode setup
[ 0.124117] lvtthmr 0x200 before write 0xf to APIC 0xf0
[ 0.124118] lvtthmr 0x10200 after write 0xf to APIC 0xf0
This results in CPU 0 soft lockups depending on the placement in time
when the APIC soft-disable happens. Those soft lockups are not 100%
reproducible and the reason for that can only be speculated as no one
tells you what SMM does. Likely, it confuses the SMM code that the APIC
is disabled and the thermal interrupt doesn't doesn't fire at all,
leading to CPU 0 stuck in SMM forever...
Now, before
4f432e8bb15b ("x86/mce: Get rid of mcheck_intel_therm_init()")
due to how the APIC_LVTTHMR was read before APIC initialization in
mcheck_intel_therm_init(), it would read the value with the mask bit 16
clear and then intel_init_thermal() would replicate it onto the APs and
all would be peachy - the thermal interrupt would remain enabled.
But that commit moved that reading to a later moment in
intel_init_thermal(), resulting in reading APIC_LVTTHMR on the BSP too
late and with its interrupt mask bit set.
Thus, revert back to the old behavior of reading the thermal LVT
register before the APIC gets initialized.
Fixes: 4f432e8bb15b ("x86/mce: Get rid of mcheck_intel_therm_init()")
Reported-by: James Feeney <james@nurealm.net>
Signed-off-by: Borislav Petkov <bp@suse.de>
Cc: <stable@vger.kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lkml.kernel.org/r/YKIqDdFNaXYd39wz@zn.tnic
Return -EINVAL when args is invalid instead of 'ret' which is set to
zero by a previous successful call to a function.
Fixes: ca66dca5eda6 ("thermal: qcom: add support for adc-tm5 PMIC thermal monitor")
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210527092640.2070555-1-yangyingliang@huawei.com
Fix function name in ti-bandgap.c kernel-doc comment
to remove a warning.
drivers/thermal/ti-soc-thermal/ti-bandgap.c:787: warning: expecting
prototype for ti_bandgap_alert_init(). Prototype was for
ti_bandgap_talert_init() instead.
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Acked-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1621851963-36548-1-git-send-email-yang.lee@linux.alibaba.com
After commit 81ad4276b505 ("Thermal: Ignore invalid trip points") all
user_space governor notifications via RW trip point is broken in intel
thermal drivers. This commits marks trip_points with value of 0 during
call to thermal_zone_device_register() as invalid. RW trip points can be
0 as user space will set the correct trip temperature later.
During driver init, x86_package_temp and all int340x drivers sets RW trip
temperature as 0. This results in all these trips marked as invalid by
the thermal core.
To fix this initialize RW trips to THERMAL_TEMP_INVALID instead of 0.
Cc: <stable@vger.kernel.org>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210430122343.1789899-1-srinivas.pandruvada@linux.intel.com
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas
Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of
a couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał
Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well
as the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of
cleanups and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
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Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Several variables are being initialized with values that is never
read and being updated later with a new value. The initializations
are redundant and can be removed.
Addresses-Coverity: ("Unused value")
Signed-off-by: Colin Ian King <colin.king@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422120412.246291-1-colin.king@canonical.com
Use the new helper function and avoid unnecessery second lock/unlock,
which was present in old approach with thermal_cdev_update().
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422153624.6074-4-lukasz.luba@arm.com
Use the new helper function and avoid unnecessery second lock/unlock,
which was present in old approach with thermal_cdev_update().
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422153624.6074-3-lukasz.luba@arm.com
The tz->lock must be hold during the looping over the instances in that
thermal zone. This lock was missing in the governor code since the
beginning, so it's hard to point into a particular commit.
CC: stable@vger.kernel.org # 4.4+
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422153624.6074-2-lukasz.luba@arm.com
The cooling device state change generates an event, also when there is no
need, because temperature is low and device is not throttled. Avoid to
unnecessary update the cooling device which means also not sending event.
The cooling device state has not changed because the temperature is still
below the first activation trip point value, so we can do this.
Add a tracking mechanism to make sure it updates cooling devices only
once - when the temperature dropps below first trip point.
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422114308.29684-4-lukasz.luba@arm.com
When the temperature is below the first activation trip point the cooling
devices are not checked, so they cannot maintain fresh statistics. It
leads into the situation, when temperature crosses first trip point, the
statistics are stale and show state for very long period. This has impact
on IPA algorithm calculation and wrong decisions. Thus, check the cooling
devices even when the temperature is low, to refresh these statistics.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422114308.29684-3-lukasz.luba@arm.com
There is a need to have a helper function which updates cooling device
state from the governors code. With this change governor can use
lock and unlock while calling helper function. This avoid unnecessary
second time lock/unlock which was in previous solution present in
governor implementation. This new helper function must be called
with mutex 'cdev->lock' hold.
The changed been discussed and part of code presented in thread:
https://lore.kernel.org/linux-pm/20210419084536.25000-1-lukasz.luba@arm.com/
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210422114308.29684-2-lukasz.luba@arm.com
Add support for tsens present in ipq806x SoCs based on generic msm8960
tsens driver.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-9-ansuelsmth@gmail.com
Drop unused define for msm8960 replaced by generic api and reg_field.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-8-ansuelsmth@gmail.com
Rework calibrate function to use common function. Derive the offset from
a missing hardcoded slope table and the data from the nvmem calib
efuses.
Drop custom get_temp function and use generic api.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-7-ansuelsmth@gmail.com
Device based on tsens VER_0 contains a hardware bug that results in some
problem with sensor enablement. Sensor id 6-11 can't be enabled
selectively and all of them must be enabled in one step.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-6-ansuelsmth@gmail.com
Use init_common and drop custom init for msm8960.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-5-ansuelsmth@gmail.com
VER_0 is used to describe device based on tsens version before v0.1.
These device are devices based on msm8960 for example apq8064 or
ipq806x. Add support for VER_0 in tsens.c and set the right tsens feat
in tsens-8960.c file.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-4-ansuelsmth@gmail.com
Convert msm9860 driver to reg_field to use the init_common
function.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-3-ansuelsmth@gmail.com
Function compute_intercept_slope hardcode the sensor slope to
SLOPE_DEFAULT. Change this and use the default value only if a slope is
not defined. This is needed for tsens VER_0 that has a hardcoded slope
table.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-2-ansuelsmth@gmail.com
thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org
The function ti_bandgap_restore_ctxt() restores the context at resume
time. It checks if the sensor has a counter, reads the register but
does nothing with the value.
The block was probably omitted by the commit b87ea759a4cc.
Remove the unused variable as well as the block using it as we can
consider it as dead code.
Reported-by: Hulk Robot <hulkci@huawei.com>
Fixes: b87ea759a4cc ("staging: omap-thermal: fix context restore function")
Signed-off-by: Lin Ruizhe <linruizhe@huawei.com>
Reviewed-by: Tony Lindgren <tony@atomide.com>
Tested-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210421084256.57591-1-linruizhe@huawei.com
For the sake of lisibility, reorder the header files alphabetically.
Signed-off-by: Zhen Lei <thunder.leizhen@huawei.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210406091912.2583-2-thunder.leizhen@huawei.com
Use the devm_platform_ioremap_resource_byname() helper instead of
calling platform_get_resource_byname() and devm_ioremap_resource()
separately.
Signed-off-by: dingsenjie <dingsenjie@yulong.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210414063943.96244-1-dingsenjie@163.com
There is a error message within devm_ioremap_resource
already, so remove the dev_err call to avoid redundant
error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ye Bin <yebin10@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210409075224.2109503-1-yebin10@huawei.com
On Intel processors, the core frequency can be reduced below OS request,
when the current temperature reaches the TCC (Thermal Control Circuit)
activation temperature.
The default TCC activation temperature is specified by
MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an
offset in degrees C, using the TCC Offset bits in the same MSR register.
This patch introduces a cooling devices driver that utilizes the TCC
Offset feature. The bigger the current cooling state is, the lower the
effective TCC activation temperature is, so that the processors can be
throttled earlier before system critical overheats.
Note that, on different platforms, the behavior might be different on
how fast the setting takes effect, and how much the CPU frequency is
reduced.
This patch has been tested on a KabyLake mobile platform from me, and also
on a CometLake platform from Doug.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested by: Doug Smythies <dsmythies@telus.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210412125901.12549-1-rui.zhang@intel.com
There is a error message within devm_ioremap_resource already, so
remove the dev_err call to avoid redundant error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ruiqi Gong <gongruiqi1@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210408100329.7585-1-gongruiqi1@huawei.com
There is a error message within devm_ioremap_resource already, so
remove the dev_err call to avoid redundant error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ruiqi Gong <gongruiqi1@huawei.com>
Acked-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210408100144.7494-1-gongruiqi1@huawei.com
MDM9607 TSENS IP is very similar to the one of MSM8916, with
minor adjustments to various tuning values.
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319220802.198215-2-konrad.dybcio@somainline.org
Fixes coccicheck error:
drivers/thermal/qcom/tsens.c:759:4-10: ERROR: missing put_device; call
of_find_device_by_node on line 715, but without a corresponding object
release within this function.
Fixes: a7ff82976122 ("drivers: thermal: tsens: Merge tsens-common.c into tsens.c")
Signed-off-by: Guangqing Zhu <zhuguangqing83@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210404125431.12208-1-zhuguangqing83@gmail.com
Add support for TEMP_ALARM GEN2 PMIC peripherals with digital
major revision 1. This revision utilizes a different temperature
threshold mapping than earlier revisions.
Signed-off-by: David Collins <collinsd@codeaurora.org>
Signed-off-by: Guru Das Srinagesh <gurus@codeaurora.org>
Reviewed-by: Stephen Boyd <sboyd@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/69c90a004b3f5b7ae282f5ec5ca2920a48f23e02.1596040416.git.gurus@codeaurora.org
Slab OOB issue is scanned by KASAN in cpu_power_to_freq().
If power is limited below the power of OPP0 in EM table,
it will cause slab out-of-bound issue with negative array
index.
Return the lowest frequency if limited power cannot found
a suitable OPP in EM table to fix this issue.
Backtrace:
[<ffffffd02d2a37f0>] die+0x104/0x5ac
[<ffffffd02d2a5630>] bug_handler+0x64/0xd0
[<ffffffd02d288ce4>] brk_handler+0x160/0x258
[<ffffffd02d281e5c>] do_debug_exception+0x248/0x3f0
[<ffffffd02d284488>] el1_dbg+0x14/0xbc
[<ffffffd02d75d1d4>] __kasan_report+0x1dc/0x1e0
[<ffffffd02d75c2e0>] kasan_report+0x10/0x20
[<ffffffd02d75def8>] __asan_report_load8_noabort+0x18/0x28
[<ffffffd02e6fce5c>] cpufreq_power2state+0x180/0x43c
[<ffffffd02e6ead80>] power_actor_set_power+0x114/0x1d4
[<ffffffd02e6fac24>] allocate_power+0xaec/0xde0
[<ffffffd02e6f9f80>] power_allocator_throttle+0x3ec/0x5a4
[<ffffffd02e6ea888>] handle_thermal_trip+0x160/0x294
[<ffffffd02e6edd08>] thermal_zone_device_check+0xe4/0x154
[<ffffffd02d351cb4>] process_one_work+0x5e4/0xe28
[<ffffffd02d352f44>] worker_thread+0xa4c/0xfac
[<ffffffd02d360124>] kthread+0x33c/0x358
[<ffffffd02d289940>] ret_from_fork+0xc/0x18
Fixes: 371a3bc79c11b ("thermal/drivers/cpufreq_cooling: Fix wrong frequency converted from power")
Signed-off-by: brian-sy yang <brian-sy.yang@mediatek.com>
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Cc: stable@vger.kernel.org #v5.7
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201229050831.19493-1-michael.kao@mediatek.com
When the function successfully finishes it logs an information about
the registration of the cooling device and use its name to build the
message. Unfortunately it was freed right before:
drivers/thermal/cpuidle_cooling.c:218 __cpuidle_cooling_register()
warn: 'name' was already freed.
Fix this by freeing after the message happened.
Fixes: 6fd1b186d900 ("thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering")
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20210319202522.891061-1-daniel.lezcano@linaro.org
