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Added identifier names to respective definitions for fix
warnings reported by checkpatch.pl
WARNING: function definition argument 'void *' should also have an identifier name
WARNING: function definition argument 'int *' should also have an identifier name
Signed-off-by: Bragatheswaran Manickavel <bragathemanick0908@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230917083443.3220-1-bragathemanick0908@gmail.com
The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
nvmem_cell_read_u32() may return -EPROBE_DEFER if NVMEM supplier has not
yet been probed. Future reprobe may succeed, so printing:
i.mx8mm_thermal 30260000.tmu: Failed to read OCOTP nvmem cell (-517).
to the log is confusing. Fix this by using dev_err_probe. This also
elevates the message from warning to error, which is more correct: The
log message is only ever printed in probe error path and probe aborts
afterwards, so it really warrants an error-level message.
Fixes: 4032916488 ("thermal/drivers/imx: Add support for loading calibration data from OCOTP")
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Reviewed-by: Marek Vasut <marex@denx.de>
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230708112647.2897294-1-a.fatoum@pengutronix.de
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values in OCOTP. Add support for reading the OCOTP calibration
data and programming those into the TMU hardware.
The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4,
the programming differs in each case.
Based on U-Boot commits:
70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR")
ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP")
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Check against the upper temperature limit (125 degrees C) before
consider the temperature valid.
Fixes: 5eed800a68 ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit")
Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-17-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The i.MX 8MP has a ADC_PD bit in the TMU_TER register that controls the
operating mode of the ADC:
* 0 means normal operating mode
* 1 means power down mode
When enabling/disabling the TMU, the ADC operating mode must be set
accordingly.
i.MX 8M Mini & Nano are lacking this bit.
Signed-off-by: Paul Gerber <Paul.Gerber@tq-group.com>
Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Fixes: 2b8f1f0337 ("thermal: imx8mm: Add i.MX8MP support")
Link: https://lore.kernel.org/r/20211122114225.196280-1-alexander.stein@ew.tq-group.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Currently the error message does not print the correct error code.
Fix it by initializing 'ret' to the proper error code.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201202232448.2692-1-festevam@gmail.com
dev_err_probe() can reduce code size, uniform error handling and record the
defer probe reason etc., use it to simplify the code.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1597129185-8460-2-git-send-email-Anson.Huang@nxp.com
The current codebase makes use of the zero-length array language
extension to the C90 standard, but the preferred mechanism to declare
variable-length types such as these ones is a flexible array member[1][2],
introduced in C99:
struct foo {
int stuff;
struct boo array[];
};
By making use of the mechanism above, we will get a compiler warning
in case the flexible array does not occur last in the structure, which
will help us prevent some kind of undefined behavior bugs from being
inadvertently introduced[3] to the codebase from now on.
Also, notice that, dynamic memory allocations won't be affected by
this change:
"Flexible array members have incomplete type, and so the sizeof operator
may not be applied. As a quirk of the original implementation of
zero-length arrays, sizeof evaluates to zero."[1]
sizeof(flexible-array-member) triggers a warning because flexible array
members have incomplete type[1]. There are some instances of code in
which the sizeof operator is being incorrectly/erroneously applied to
zero-length arrays and the result is zero. Such instances may be hiding
some bugs. So, this work (flexible-array member conversions) will also
help to get completely rid of those sorts of issues.
This issue was found with the help of Coccinelle.
[1] https://gcc.gnu.org/onlinedocs/gcc/Zero-Length.html
[2] https://github.com/KSPP/linux/issues/21
[3] commit 7649773293 ("cxgb3/l2t: Fix undefined behaviour")
Signed-off-by: Gustavo A. R. Silva <gustavoars@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507192517.GA16557@embeddedor
i.MX8MP shares same TMU with i.MX8MM, the only difference is i.MX8MP
has two thermal sensors while i.MX8MM ONLY has one, add multiple sensors
support for i.MX8MM TMU driver.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1584674791-9717-2-git-send-email-Anson.Huang@nxp.com
i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
