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When cpumask is specified as a module parameter the value is
overwritten by the module init routine. This can easily be fixed
by checking to see if the mask has already been allocated in the
init routine.
When max_idle is specified as a module parameter a panic will occur.
The problem is that the idle_injection_cpu_mask is not allocated until
the module init routine executes. This can easily be fixed by allocating
the cpumask if it's not already allocated.
Fixes: ebf519710218 ("thermal: intel: powerclamp: Add two module parameters")
Signed-off-by: David Arcari <darcari@redhat.com>
Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the sake of consistency, revert the second part of the
thermal_hwmon.c hunk from commit dec07d399cc8 ("thermal: Don't use
'device' internal thermal zone structure field") after the first
part of it has been reverted.
Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Commit 52f04f10b900 ("thermal: intel: int340x: processor_thermal: Fix
deadlock") addressed deadlock issue during user space trip update. But it
missed a case when thermal zone device is disabled when user writes 0.
Call to thermal_zone_device_disable() also causes deadlock as it also
tries to lock tz->lock, which is already claimed by trip_point_temp_store()
in the thermal core code.
Remove call to thermal_zone_device_disable() in the function
sys_set_trip_temp(), which is called from trip_point_temp_store().
Fixes: 52f04f10b900 ("thermal: intel: int340x: processor_thermal: Fix deadlock")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When the hwmon device node of a thermal zone device is not found,
using hwmon->device causes a kernel NULL pointer dereference.
Fixes: dec07d399cc8 ("thermal: Don't use 'device' internal thermal zone structure field")
Reported-by: Preble Adam C <adam.c.preble@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The lockdep_assert_held() calls added to cooling_device_stats_setup()
and cooling_device_stats_destroy() by commit 790930f44289 ("thermal:
core: Introduce thermal_cooling_device_update()") trigger false-positive
lockdep reports in code paths that are not subject to race conditions
(before cooling device registration and after cooling device removal).
For this reason, remove the lockdep_assert_held() calls from both
cooling_device_stats_setup() and cooling_device_stats_destroy() and
add one to thermal_cooling_device_stats_reinit() that has to be called
under the cdev lock.
Fixes: 790930f44289 ("thermal: core: Introduce thermal_cooling_device_update()")
Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.com
Reported-by: Imre Deak <imre.deak@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 7c3d5c20dc16 ("thermal/core: Add a generic thermal_zone_get_trip()
function") stopped marking trip points with a zero temperature as
disabled, behavior that was originally introduced in commit 81ad4276b505
("Thermal: Ignore invalid trip points").
When using the mlxsw driver we see that when such trip points are not
disabled, the thermal subsystem repeatedly tries to set the state of the
associated cooling devices to the maximum state.
Address this by restoring the original behavior and mark trip points
with a zero temperature as disabled.
Fixes: 7c3d5c20dc16 ("thermal/core: Add a generic thermal_zone_get_trip() function")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Introduce a helper function, thermal_cooling_device_present(), for
checking if the given cooling device is in the list of registered
cooling devices to avoid some code duplication in a subsequent
patch.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
When setting a trip point temperature from sysfs, there is an upper
bound check on the user input, but no lower bound check.
As hardware register has 7 bits for a trip point temperature, the offset
to tj_max of the input temperature must be equal to/less than 0x7f.
Or else,
1. bogus temperature is updated into the trip temperature bits.
2. the upper bits of the register can be polluted.
For example,
$ rdmsr 0x1b2
2000003
$ echo -180000 > /sys/class/thermal/thermal_zone1/trip_point_1_temp
$ rdmsr 0x1b2
3980003
Not only the trip point temp is set to 76C on this platform (tj_max is
100), the Power Notification (Bit 24) is also enabled erronously.
Fix the problem by adding lower bound check for sysfs input.
Reported-by: Dan Carpenter <error27@gmail.com>
Link: https://lore.kernel.org/all/add7a378-4d50-4ba1-81d3-a0c17db25a0b@kili.mountain/
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MT8365 is similar to the other SoCs supported by the driver. It has only
one bank and 3 actual sensors that can be multiplexed. There is another
one sensor that does not have usable data.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-3-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add logic in order to be able to turn on the control buffer on MT8365.
This change now allows to have control buffer support for MTK_THERMAL_V1,
and it allows to define the register offset, and mask used to enable it.
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-2-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge thermal control updates for 6.4-rc1:
- Add a thermal zone 'devdata' accessor and modify several drivers to
use it (Daniel Lezcano).
- Prevent drivers from using the 'device' internal thermal zone
structure field directly (Daniel Lezcano).
- Clean up the hwmon thermal driver (Daniel Lezcano).
- Add thermal zone id accessor and thermal zone type accessor
and prevent drivers from using thermal zone fields directly (Daniel
Lezcano).
- Clean up the acerhdf and tegra thermal drivers (Daniel Lezcano).
* thermal-core:
thermal/drivers/acerhdf: Remove pointless governor test
thermal/drivers/acerhdf: Make interval setting only at module load time
thermal/drivers/tegra: Remove unneeded lock when setting a trip point
thermal/hwmon: Use the thermal_core.h header
thermal/drivers/da9062: Don't access the thermal zone device fields
thermal: Use thermal_zone_device_type() accessor
thermal: Add a thermal zone id accessor
thermal/drivers/spear: Don't use tz->device but pdev->dev
thermal/core: Add thermal_zone_device structure 'type' accessor
thermal: Don't use 'device' internal thermal zone structure field
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()
thermal: Remove debug or error messages in get_temp() ops
thermal/core: Show a debug message when get_temp() fails
thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers
thermal/core: Use the thermal zone 'devdata' accessor in hwmon located drivers
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
thermal/core: Add a thermal zone 'devdata' accessor
The function tegra_tsensor_enable_hw_channel() takes the thermal zone
lock to prevent "a potential" race with a call to set_trips()
callback.
The driver must not play with the thermal framework core code
internals.
The tegra_tsensor_enable_hw_channel() is called by:
- the suspend / resume callbacks
- the probe function after the thermal zones are registered
The thermal zone lock taken in this function is supposed to protect
from a call to the set_trips() callback which writes in the same
register.
The potential race is when suspend / resume are called at the same
time as set_trips. This one is called only in
thermal_zone_device_update().
- At suspend time, the 'in_suspend' is set, thus the
thermal_zone_device_update() bails out immediately and set_trips is
not called during this moment.
- At resume time, the thermal zone is updated at PM_POST_SUSPEND,
thus the driver has already set the TH2 temperature.
- At probe time, we register the thermal zone and then we set the
TH2. The only scenario I can see so far is the interrupt fires, the
thermal_zone_update() is called exactly at the moment
tegra_tsensor_enable_hw_channel() a few lines after registering it.
Enable the channels before setting up the interrupt. We close the
potential race window without using the thermal zone's lock.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Thierry Reding <thierry.reding@gmail.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal_hwmon is playing with the thermal core code
internals. Changing the code would be too invasive for now.
We can consider the thermal_hwmon.c is part of the thermal core code
as it provides a glue to tie the hwmon and the thermal zones.
Let's include the thermal_core.h header.
No functional change intended.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver is reading the passive polling rate in the thermal zone
structure. We want to prevent the drivers to rummage around in the
thermal zone structure.
On the other side, the delay is what the driver passed to the
thermal_zone_device_register() function, so it has already the
information.
Reuse the information we have instead of reading the information we
set.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Replace the accesses to 'tz->type' by its accessor version in order to
self-encapsulate the thermal_zone_device structure.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use the spear associated device instead of the thermal zone device
which belongs to the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some drivers are directly using the thermal zone's 'device' structure
field.
Use the driver device pointer instead of the thermal zone device when
it is available.
Remove the traces when they are duplicate with the traces in the core
code.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek LVTS
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.
Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.
Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When user space updates the trip point there is a deadlock, which results
in caller gets blocked forever.
Commit 05eeee2b51b4 ("thermal/core: Protect sysfs accesses to thermal
operations with thermal zone mutex"), added a mutex for tz->lock in the
function trip_point_temp_store(). Hence, trip set callback() can't
call any thermal zone API as they are protected with the same mutex lock.
The callback here calling thermal_zone_device_enable(), which will result
in deadlock.
Move the thermal_zone_device_enable() to proc_thermal_pci_probe() to
avoid this deadlock.
Fixes: 05eeee2b51b4 ("thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter).
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select REGMAP
which is not user-visible instead of depending on it (Randy Dunlap).
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Merge tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix two issues in the Intel thermal control drivers.
Specifics:
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter)
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select
REGMAP which is not user-visible instead of depending on it (Randy
Dunlap)"
* tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
thermal: intel: quark_dts: fix error pointer dereference
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.
Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.
Therefore, change the use of "depends on REGMAP" to "select REGMAP".
Fixes: b474303ffd57 ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If alloc_soc_dts() fails, then we can just return. Trying to free
"soc_dts" will lead to an Oops.
Fixes: 8c1876939663 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv
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Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC driver updates from Arnd Bergmann:
"As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv"
* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
power: supply: Introduce Qualcomm PMIC GLINK power supply
soc: apple: rtkit: Do not copy the reg state structure to the stack
soc: sunxi: SUN20I_PPU should depend on PM
memory: renesas-rpc-if: Remove redundant division of dummy
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
...
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported. We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.
Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The commit 74c8e6bffbe1 ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Fixes: 7d3a2a2bbadb ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.
The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.
Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.
Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.
According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.
A thermal domains can be the MCU or the AP.
Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.
The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.
The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.
The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
On MT8195 Tomato Chromebook:
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge thermal control changes related to Intel platforms for 6.3-rc1:
- Rework ACPI helper functions for thermal control to retrieve a trip
point temperature instead of initializing a trip point objetc (Rafael
Wysocki).
- Clean up and improve the int340x thermal driver ((Rafael Wysocki).
- Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).
- Fix the Intel powerclamp thermal driver and make it use the common
idle injection framework (Srinivas Pandruvada).
- Add two module parameters, cpumask and max_idle, to the Intel powerclamp
thermal driver to allow it to affect only a specific subset of CPUs
instead of all of them (Srinivas Pandruvada).
- Make the Intel quark_dts thermal driver Use generic trip point
objects instead of its own trip point representation (Daniel
Lezcano).
- Add toctree entry for thermal documents and fix two issues in the
Intel powerclamp driver documentation (Bagas Sanjaya).
* thermal-intel: (25 commits)
Documentation: powerclamp: Fix numbered lists formatting
Documentation: powerclamp: Escape wildcard in cpumask description
Documentation: admin-guide: Add toctree entry for thermal docs
thermal: intel: powerclamp: Add two module parameters
Documentation: admin-guide: Move intel_powerclamp documentation
thermal: intel: powerclamp: Fix duration module parameter
thermal: intel: powerclamp: Return last requested state as cur_state
thermal: intel: quark_dts: Use generic trip points
thermal: intel: powerclamp: Use powercap idle-inject feature
powercap: idle_inject: Add update callback
powercap: idle_inject: Export symbols
thermal: intel: powerclamp: Fix cur_state for multi package system
thermal: intel: intel_pch: Drop struct board_info
thermal: intel: intel_pch: Rename board ID symbols
thermal: intel: intel_pch: Fold suspend and resume routines into their callers
thermal: intel: intel_pch: Fold two functions into their callers
thermal: intel: intel_pch: Eliminate device operations object
thermal: intel: intel_pch: Rename device operations callbacks
thermal: intel: intel_pch: Eliminate redundant return pointers
thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
...
Merge thermal control core changes for 6.3-rc1:
- Clean up thermal device unregistration code (Viresh Kumar).
- Fix and clean up thermal control core initialization error code
paths (Daniel Lezcano).
- Relocate the trip points handling code into a separate file (Daniel
Lezcano).
- Make the thermal core fail registration of thermal zones and cooling
devices if the thermal class has not been registered (Rafael Wysocki).
- Make the core thermal control code use sysfs_emit_at() instead of
scnprintf() where applicable (ye xingchen).
* thermal-core:
thermal: core: Use sysfs_emit_at() instead of scnprintf()
thermal: Fail object registration if thermal class is not registered
thermal/core: Move the thermal trip code to a dedicated file
thermal/core: Remove unneeded ida_destroy()
thermal/core: Fix unregistering netlink at thermal init time
thermal: core: Use device_unregister() instead of device_del/put()
thermal: core: Move cdev cleanup to thermal_release()
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
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Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers
More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
dt-bindings: soc: qcom: Introduce PMIC GLINK binding
soc: qcom: dcc: Drop driver for now
Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.
Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.
cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.
max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.
Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
