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i.MX93 use TMU version 2.1, which supports:
- TRITSR_TP5(When this field is 1, you must add 0.5 K to the temperature
that TEMP reports. For example, if TEMP is 300 K and TP5=1, then the
final temperature is 300.5 K.)
- Has 16 TTRCR register: Temperature Range Control (TTRCR0 - TTRCR15)
This patch is to add this support.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-4-peng.fan@oss.nxp.com
There are MAX 16 sensors, but not all of them supported. Such as
i.MX8MQ, there are only 3 sensors. Enabling all 16 sensors will
touch reserved bits from i.MX8MQ reference mannual, and TMU will stuck,
temperature will not update anymore.
Fixes: 45038e03d6 ("thermal: qoriq: Enable all sensors before registering them")
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-3-peng.fan@oss.nxp.com
No need to program site adjustment register, as programming
these registers do not give accurate value and also these
registers are not mentioned in Reference Manual.
Signed-off-by: Pankit Garg <pankit.garg@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-2-peng.fan@oss.nxp.com
Register thermal zones as hwmon sensors to let userspace read
temperatures using standard hwmon interface.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230613091317.1691247-1-wenst@chromium.org
Should an error occur after calling sun8i_ths_resource_init() in the probe
function, some resources need to be released, as already done in the
.remove() function.
Switch to the devm_clk_get_enabled() helper and add a new devm_action to
turn sun8i_ths_resource_init() into a fully managed function.
Move the place where reset_control_deassert() is called so that the
recommended order of reset release/clock enable steps is kept.
A64 manual states that:
3.3.6.4. Gating and reset
Make sure that the reset signal has been released before the release of
module clock gating;
This fixes the issue and removes some LoC at the same time.
Fixes: dccc5c3b6f ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40")
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a8ae84bd2dc4b55fe428f8e20f31438bf8bb6762.1684089931.git.christophe.jaillet@wanadoo.fr
This reverts commit f05c7b7d9e.
That change was causing a regression in the generic-adc-thermal-probed
bootrr test as reported in the kernelci-results list [1].
A proper rework will take longer, so revert it for now.
[1] https://groups.io/g/kernelci-results/message/42660
Fixes: f05c7b7d9e ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe")
Signed-off-by: Ricardo Cañuelo <ricardo.canuelo@collabora.com>
Suggested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].
The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].
Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
- TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET
- TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.
[1]: d9d2db1b82
[2]: d75aef53a7
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136
Fixes: a2149ab815 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1b ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599a ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7 ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.
The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
Gen4 will be very different, so refactor Gen3 access into separate call
first.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
Since commit 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel
TCC library") intel_soc_dts_iosf is reporting the wrong temperature.
The driver expects tj_max to be in milli-degrees-celcius but after
the switch to the TCC library this is now in degrees celcius so
instead of e.g. 90000 it is set to 90 causing a temperature 45
degrees below tj_max to be reported as -44910 milli-degrees
instead of as 45000 milli-degrees.
Fix this by adding back the lost factor of 1000.
Fixes: 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library")
Reported-by: Bernhard Krug <b.krug@elektronenpumpe.de>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Export Passive version 2 table similar to the way _TRT and _ART tables
via IOCTLs.
This removes need for binary utility to read ACPI Passive 2 table by
providing open source support. This table already has open source
implementation in the user space thermald, when the table is part of
data vault exported by the int3400 sysfs.
This table is supported in some older platforms before Ice Lake
generation.
Passive 2 tables contain multiple entries. Each entry has following
fields:
* Source: Named Reference (String). This is the source device for
temperature.
* Target: Named Reference (String). This is the target device to
control.
* Priority: Priority of this device compared to others.
* SamplingPeriod: Time Period in 1/10 of seconds unit.
* PassiveTemp: Passive Temperature in 1/10 of Kelvin.
* SourceDomain: Domain for the source (00:Processor, others reserved).
* ControlKnob: Type of control knob (00:Power Limit 1, others: reserved)
* Limit: The target state to set on reaching passive temperature.
This can be a string "max", "min" or a power limit value.
* LimitStepSize: Step size during activation.
* UnLimitStepSize: Step size during deactivation.
* Reserved1: Reserved
Three IOCTLs are added similar to IOCTLs for reading TRT:
ACPI_THERMAL_GET_PSVT_COUNT: Number of passive 2 entries.
ACPI_THERMAL_GET_PSVT_LEN: Total return data size (count x each
passive 2 entry size).
ACPI_THERMAL_GET_PSVT: Get the data as an array of objects with
passive 2 entries.
This change is based on original development done by:
Todd Brandt <todd.e.brandt@linux.intel.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog and subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use
sysfs_emit_at() instead of scnprintf()", there was a new line after each
UUID string.
With the newline removed, existing user space like "thermald" fails to
compare each supported UUID as it is using getline() to read UUID and
apply correct thermal table.
To avoid breaking existing user space, add newline after each UUID string.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 763bd29fd3 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()")
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Different RAPL Interfaces may have different primitive information and
rapl_defaults calls.
To better distinguish this difference in the RAPL framework code,
introduce a new enum to represent different types of RAPL Interfaces.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MSR RAPL Interface always removes a rapl_package when all the CPUs in
that rapl_package are offlined. This is because it relies on an online
CPU to access the MSR.
But for RAPL Interface using MMIO registers, when all the cpus within
the rapl_package are offlined,
1. the register can still be accessed
2. monitoring and setting the Power Pimits for the rapl_package is still
meaningful because of uncore power.
This means that, a valid rapl_package doesn't rely on one or more cpus
being onlined.
For this sense, make cpu optional for rapl_package. A rapl_package can
be registered either using a CPU id to represent the physical
package/die, or using the physical package id directly.
Note that, the thermal throttling interrupt is not disabled via
MSR_IA32_PACKAGE_THERM_INTERRUPT for such rapl_package at the moment.
If it is still needed in the future, this can be achieved by selecting
an onlined CPU using the physical package id.
Note that, processor_thermal_rapl, the current MMIO RAPL Interface
driver, can also be converted to register using a package id instead.
But this is not done right now because processor_thermal_rapl driver
works on single-package systems only, and offlining the only package
will not happen. So keep the previous logic.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently, a RAPL package is registered with the number of Power Limits
supported in each RAPL domain. But this doesn't tell which Power Limits
are available. Using the number of Power Limits supported to guess the
availability of each Power Limit is fragile.
Use bitmap to represent the availability of each Power Limit.
Note that PL1 is mandatory thus it does not need to be set explicitly by
the RAPL Interface drivers.
No functional change intended.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If cur_state for the powerclamp cooling device is set to the default
minimum state of 0, without setting first to cur_state > 0, this results
in NULL pointer access.
This NULL pointer access happens in the powercap core idle-inject
function idle_inject_set_duration() as there is no NULL check for
idle_inject_device pointer. This pointer must be allocated by calling
idle_inject_register() or idle_inject_register_full().
In the function powerclamp_set_cur_state(), idle_inject_device pointer
is allocated only when the cur_state > 0. But setting 0 without changing
to any other state, idle_inject_set_duration() will be called with a
NULL idle_inject_device pointer.
To address this, just return from powerclamp_set_cur_state() if the
current cooling device state is the same as the last one. Since the
power-up default cooling device state is 0, changing the state to 0
again here will return without calling idle_inject_set_duration().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386
Tested-by: Risto A. Paju <teknohog@iki.fi>
Cc: 6.3+ <stable@kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
warning (Stefan Wahren).
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten).
- Fix comments for the cpuidle_cooling_register() function to match the
function prototype (Chenggang Wang).
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno).
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen).
- Use of_address_to_resource() in the Mediatek driver (Rob Herring).
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski).
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
-----BEGIN PGP SIGNATURE-----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=/bW2
-----END PGP SIGNATURE-----
Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Merge additional thermal core and ACPI thermal changes for 6.4-rc1:
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
* thermal-core:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
According to my information, there are no active users of this driver in
the field.
Moreover, it does some really questionable things and gets in the way of
thermal core improvements, so drop it.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The pch_critical() callback accesses the thermal zone device structure
internals, it dereferences the thermal zone struct device and the 'type'.
Use the available accessors instead of accessing the structure directly.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.
Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.
By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the algorithm of choosing the next target state in step_wise
governor, the code does the right thing but is implemented in a
way different from what the comment describes. And this hurts the code
readability.
As the logic in the comment is simpler, adjust the code logic to align
with the comment.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edit ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
removes support for THERMAL_TREND_RAISE_FULL/DROP_FULL but leaves the
comment unchanged.
Delete the obsolte comment about THERMAL_TREND_RAISE_FULL/DROP_FULL.
Fixes: 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to stop
including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to convert
more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones
that didn't get picked up elsewhere.
-----BEGIN PGP SIGNATURE-----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=89Zj
-----END PGP SIGNATURE-----
Merge tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull more devicetree updates from Rob Herring:
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to
stop including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to
convert more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones that
didn't get picked up elsewhere.
* tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (34 commits)
bus: tegra-gmi: Replace of_platform.h with explicit includes
hte: Use of_property_present() for testing DT property presence
w1: w1-gpio: Use of_property_read_bool() for boolean properties
virt: fsl: Use of_property_present() for testing DT property presence
soc: fsl: Use of_property_present() for testing DT property presence
sbus: display7seg: Use of_property_read_bool() for boolean properties
sparc: Use of_property_read_bool() for boolean properties
sparc: Use of_property_present() for testing DT property presence
bus: mvebu-mbus: Remove open coded "ranges" parsing
of/address: Add of_property_read_reg() helper
of/address: Add of_range_count() helper
of/address: Add support for 3 address cell bus
of/address: Add of_range_to_resource() helper
of: unittest: Add bus address range parsing tests
of: Drop cpu.h include from of_device.h
OPP: Adjust includes to remove of_device.h
irqchip: loongson-eiointc: Add explicit include for cpuhotplug.h
cpuidle: Adjust includes to remove of_device.h
cpufreq: sun50i: Add explicit include for cpu.h
cpufreq: Adjust includes to remove of_device.h
...
Replace of_get_address() and of_translate_address() calls with single
call to of_address_to_resource().
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230319163231.226738-1-robh@kernel.org
Use devm_clk_get_enabled to do automatic resource management.
Meanwhile, remove error handling labels in the probe function and
the whole remove function.
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-2-void0red@hust.edu.cn
Smatch reports:
1. mtk_thermal_probe() warn: 'apmixed_base' from of_iomap() not released.
2. mtk_thermal_probe() warn: 'auxadc_base' from of_iomap() not released.
The original code forgets to release iomap resource when handling errors,
fix it by switch to devm_of_iomap.
Fixes: 89945047b1 ("thermal: mediatek: Add tsensor support for V2 thermal system")
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-1-void0red@hust.edu.cn
The AUXADC thermal v1 allows reading temperature range between -20°C to
150°C and any value out of this range is invalid.
Add new definitions for MT8173_TEMP_{MIN_MAX} and a new small helper
mtk_thermal_temp_is_valid() to check if new readings are in range: if
not, we tell to the API that the reading is invalid by returning
THERMAL_TEMP_INVALID.
It was chosen to introduce the helper function because, even though this
temperature range is realistically ok for all, it comes from a downstream
kernel driver for version 1, but here we also support v2 and v3 which may
may have wider constraints.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-3-angelogioacchino.delregno@collabora.com
Some more testing revealed that this commit introduces a regression on some
MT8173 Chromebooks and at least on one MT6795 Sony Xperia M5 smartphone due
to the delay being apparently variable and machine specific.
Another solution would be to delay for a bit more (~70ms) but this is not
feasible for two reasons: first of all, we're adding an even bigger delay
in a probe function; second, some machines need less, some may need even
more, making the msleep at probe solution highly suboptimal.
This reverts commit 10debf8c2d.
Fixes: 10debf8c2d ("thermal/drivers/mediatek: Add delay after thermal banks initialization")
Reported-by: "kernelci.org bot" <bot@kernelci.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-2-angelogioacchino.delregno@collabora.com
Add support for DLVR (Digital Linear Voltage Regulator) attributes,
which can be used to control RFIM.
Here instead of "fivr" another directory "dlvr" is created with DLVR
attributes:
/sys/bus/pci/devices/0000:00:04.0/dlvr
├── dlvr_freq_mhz
├── dlvr_freq_select
├── dlvr_hardware_rev
├── dlvr_pll_busy
├── dlvr_rfim_enable
└── dlvr_spread_spectrum_pct
└── dlvr_control_mode
└── dlvr_control_lock
Attributes
dlvr_freq_mhz (RO):
Current DLVR PLL frequency in MHz.
dlvr_freq_select (RW):
Sets DLVR PLL clock frequency.
dlvr_hardware_rev (RO):
DLVR hardware revision.
dlvr_pll_busy (RO):
PLL can't accept frequency change when set.
dlvr_rfim_enable (RW):
0: Disable RF frequency hopping, 1: Enable RF frequency hopping.
dlvr_control_mode (RW):
Specifies how frequencies are spread. 0: Down spread, 1: Spread in Center.
dlvr_control_lock (RW):
1: future writes are ignored.
dlvr_spread_spectrum_pct (RW)
A write to this register updates the DLVR spread spectrum percent value.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)
-----BEGIN PGP SIGNATURE-----
iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAmQ5RcEACgkQqDIjiipP
6E+jqAf/Zl/FYMwkyfnnbB1PVG1u2IuJMFYrpRK8rCl+WLgcM3FXqsUaQaKhwdvM
9+qNtmCVRPPvDIkLpcwnD/bzJJfWW40NwFTEpGHf06LztGBXzqvbyKZjlMO9CeON
jfxAf/s2xuX0bCRFE+x8BX4WHRir7j7Ivw6ATk40mvgZsedAwnMI6L5P6Mw7gIu3
cpYGvM8rt0By+5VndVbuEDm9GRcOVd7ZgIFUMNUGvHBZ8IltkWmovmqWjeVIkW7Q
5gWwspSWPfe4o4RB0oUMNWNtqFOps06n+sURvrP1q8Nv9KcK5rL4ricDXoZK6eqk
IbdHvP19rPscVdN3VpbFBBt2Dm3KQA==
=yfad
-----END PGP SIGNATURE-----
Merge tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull more thermal control changes for 6.4-rc1 from Daniel Lezcano:
"- Do preparating cleaning and DT bindings for RK3588 support
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)"
* tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/core: Alloc-copy-free the thermal zone parameters structure
thermal/of: Unexport unused OF functions
thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister
thermal/drivers/mediatek/lvts_thermal: Add AP domain for mt8195
dt-bindings: thermal: mediatek: Add AP domain to LVTS thermal controllers for mt8195
thermal: amlogic: Use dev_err_probe()
thermal/drivers/mediatek/lvts_thermal: Fix sensor 1 interrupt status bitmask
MAINTAINERS: adjust entry in THERMAL/POWER_ALLOCATOR after header movement
dt-bindings: thermal: Drop unneeded quotes
thermal/core: Remove thermal_bind_params structure
thermal/drivers/tegra-bpmp: Handle offline zones
thermal/drivers/rockchip: use devm_reset_control_array_get_exclusive()
dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
thermal/drivers/rockchip: Support RK3588 SoC in the thermal driver
thermal/drivers/rockchip: Support dynamic sized sensor array
thermal/drivers/rockchip: Simplify channel id logic
thermal/drivers/rockchip: Use dev_err_probe
thermal/drivers/rockchip: Simplify clock logic
thermal/drivers/rockchip: Simplify getting match data
Now that of_cpu_device_node_get() is defined in of.h, of_device.h is just
implicitly including other includes, and is no longer needed. Adjust the
include files with what was implicitly included by of_device.h (cpu.h and
of.h) and drop including of_device.h.
Acked-by: Rafael J. Wysocki <rafael@kernel.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230329-dt-cpu-header-cleanups-v1-12-581e2605fe47@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Some older processors don't allow BIT(13) and BIT(15) in the current
mask set by "THERM_STATUS_CLEAR_CORE_MASK". This results in:
unchecked MSR access error: WRMSR to 0x19c (tried to
write 0x000000000000aaa8) at rIP: 0xffffffff816f66a6
(throttle_active_work+0xa6/0x1d0)
To avoid unchecked MSR issues, check CPUID for each relevant feature and
use that information to set the supported feature bits only in the
"clear" mask for cores. Do the same for the analogous package mask set
by "THERM_STATUS_CLEAR_PKG_MASK".
Introduce functions thermal_intr_init_core_clear_mask() and
thermal_intr_init_pkg_clear_mask() to set core and package mask bits,
respectively. These functions are called during initialization.
Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Rui Salvaterra <rsalvaterra@gmail.com>
Link: https://lore.kernel.org/lkml/cdf43fb423368ee3994124a9e8c9b4f8d00712c6.camel@linux.intel.com/T/
Tested-by: Rui Salvaterra <rsalvaterra@gmail.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@kernel.org> # 6.2+
[ rjw: Renamed 2 funtions and 2 static variables, edited subject and
changelog ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The caller of the function thermal_zone_device_register_with_trips()
can pass a thermal_zone_params structure parameter.
This one is used by the thermal core code until the thermal zone is
destroyed. That forces the caller, so the driver, to keep the pointer
valid until it unregisters the thermal zone if we want to make the
thermal zone device structure private the core code.
As the thermal zone device structure would be private, the driver can
not access to thermal zone device structure to retrieve the tzp field
after it passed it to register the thermal zone.
So instead of forcing the users of the function to deal with the tzp
structure life cycle, make the usage easier by allocating our own
thermal zone params, copying the parameter content and by freeing at
unregister time. The user can then create the parameters on the stack,
pass it to the registering function and forget about it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-3-daniel.lezcano@linaro.org
The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.
Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org
The driver is using the devm_thermal_of_zone_device_register().
In the error path of the function calling
devm_thermal_of_zone_device_register(), the function
devm_thermal_of_zone_unregister() should be called instead of
thermal_of_zone_unregister(), otherwise this one will be called twice
when the device is freed.
The same happens for the remove function where the devm_ guarantee the
thermal_of_zone_unregister() will be called, so adding this call in
the remove function will lead to a double free also.
Use devm_ variant in the error path of the probe function.
Remove thermal_of_zone_unregister() in the remove function.
Cc: Florian Fainelli <f.fainelli@gmail.com>
Cc: Ray Jui <rjui@broadcom.com>
Cc: Scott Branden <sbranden@broadcom.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-1-daniel.lezcano@linaro.org
Add MT8195 AP Domain support to LVTS Driver.
Take the opportunity to update the comments to show calibration data
information related to the new domain.
[dlezcano]: Massaged a bit the changelog
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Tested-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307154524.118541-3-bchihi@baylibre.com
Replace the open-code with dev_err_probe() to simplify the code.
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241020110014476@zte.com.cn
The binary representation for sensor 1 interrupt status was incorrectly
assembled, when compared to the full table given in the same comment
section. The conversion into hex was also incorrect, leading to
incorrect interrupt status bitmask for sensor 1. This would cause the
driver to incorrectly identify changes for sensor 1, when in fact it
was sensor 0, or a sensor access time out.
Fix the binary and hex representations in the comments, and the actual
bitmask macro.
Fixes: f5f633b182 ("thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver")
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230328031017.1360976-1-wenst@chromium.org
Thermal zones located in power domains may not be accessible when
the domain is powergated. In this situation, reading the temperature
will return -BPMP_EFAULT. When evaluating trips, BPMP will internally
use -256C as the temperature for offline zones.
For smooth operation, for offline zones, return -EAGAIN when reading
the temperature and allow registration of zones even if they are
offline during probe.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330094904.2589428-1-cyndis@kapsi.fi
Switch devm_reset_control_array_get() to
devm_reset_control_array_get_exclusive().
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Philipp Zabel <p.zabel@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241108553006227@zte.com.cn
Dynamically allocate the sensors array based on the amount
of platform sensors in preparation for rk3588 support, which
needs 7 sensors.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-6-sebastian.reichel@collabora.com
Replace the channel ID lookup table by a simple offset, since
the channel IDs are consecutive.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20230308112253.15659-5-sebastian.reichel@collabora.com
Use dev_err_probe to simplify error printing in the driver's probe
routine.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-4-sebastian.reichel@collabora.com
By using devm_clk_get_enabled() the clock acquisition and
enabling can be done in one step with automatic error
handling.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-3-sebastian.reichel@collabora.com
It's possible to directly get the match data in a generic
way nowadays.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-2-sebastian.reichel@collabora.com
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)
-----BEGIN PGP SIGNATURE-----
iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAmQof0cACgkQqDIjiipP
6E/tXQgArKKlM52mo3pg880JsiWOWGrS7pJN0x9MR0nqUm83sLTDf21fPoYmn+EJ
wrzClIX1iHCDVCWCVxao7OIT1mxez9L2NAHseXDSDQJcZ0fflTE8wZ8xeLr6q5GN
/ifHfCqiC98yejPcKIf2TqdGgqpCzyQ++sZoc3H6/jwysSkFlBc+YgKx+XasQR6k
5swQ3E81zx0ouB+t1GDieXB6YRsjZzR2KQbbExoHexPue1DTIuuumz8M1Fgz4a4b
gXRHbrGp3vmLORIAOZiVDyjzC7jwy7oN552g16yZLGDUdLaJ03gRRx7fvNzDUEMW
mBzxak4WnNWEatCh691X6W5MdPO/uQ==
=naJV
-----END PGP SIGNATURE-----
Merge tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control material for 6.4-rc1 from Daniel Lezcano:
"- Add more thermal zone device encapsulation: prevent setting
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram
Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)"
* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/ti: Use fixed update interval
thermal/drivers/stm: Don't set no_hwmon to false
thermal/drivers/db8500: Use driver dev instead of tz->device
thermal/core: Relocate the traces definition in thermal directory
thermal/drivers/hisi: Use devm_platform_ioremap_resource()
thermal/drivers/imx: Use the thermal framework for the trip point
thermal/drivers/imx: Remove get_trip_temp ops
thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
thermal/drivers/mediatek: Add delay after thermal banks initialization
thermal/drivers/mediatek: Add support for MT8365 SoC
thermal/drivers/mediatek: Control buffer enablement tweaks
dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
Once thermal_list_lock has been acquired in
__thermal_cooling_device_register(), it is not necessary to drop it
and take it again until all of the thermal zones have been updated,
so change the code accordingly.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently the TI thermal driver sets the sensor update interval based
on the polling of the thermal zone. In order to get the polling rate,
the code inspects the thermal zone device structure internals, thus
breaking the self-encapsulation of the thermal framework core
framework.
On the other side, we see the common polling rates set in the device
tree for the platforms using this driver are 500 or 1000 ms.
Setting the polling rate to 250 ms would be far enough to cover the
combination we found in the device tree.
Instead of accessing the thermal zone device structure polling rate,
let's use a common update interval of 250 ms for the driver.
Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-6-daniel.lezcano@linaro.org
The db8500 driver uses the thermal zone device instead of the device
attached to it. In order to prevent the drivers to access the thermal
zone device structure, replace the thermal zone device by the driver
to show the debug message.
Cc: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-5-daniel.lezcano@linaro.org
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.
Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
According to commit 7945f929f1 ("drivers: provide
devm_platform_ioremap_resource()"), convert platform_get_resource(),
devm_ioremap_resource() to a single call to Use
devm_platform_ioremap_resource(), as this is exactly what this
function does.
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Link: https://lore.kernel.org/r/20230308062719.79522-1-yang.lee@linux.alibaba.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal framework provides an API to get the trip related to a
trip point id. We want to consolidate the generic trip points code,
thus preventing the different drivers to deal with the trip points
after they registered them.
The set_trip_temp ops will be changed regarding the above changes but
first we need to rework a bit the different implementation in the
drivers.
The goal is to prevent using the trip id but use a trip point passed
as parameter which will contain all the needed information.
As we don't have the trip point passed as parameter yet, we get the
trip point using the generic trip thermal framewrok APIs and use it to
take exactly the same decisions.
The difference with this change and the previous code is from where we
get the thermal trip point (which is the same).
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The i.MX thermal sensor uses the generic trip points. The thermal
framework can return the critical temperature directly.
Remove the pointless get_trip_temp ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-1-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Thermal sensor reads performed immediately after thermal bank
initialization returns bogus values. This is currently tackled by returning
0 if the temperature is bogus (exceeding 200000).
Instead, add a delay between the bank init and the thermal zone device
register to properly fix this.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-5-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When cpumask is specified as a module parameter the value is
overwritten by the module init routine. This can easily be fixed
by checking to see if the mask has already been allocated in the
init routine.
When max_idle is specified as a module parameter a panic will occur.
The problem is that the idle_injection_cpu_mask is not allocated until
the module init routine executes. This can easily be fixed by allocating
the cpumask if it's not already allocated.
Fixes: ebf5197102 ("thermal: intel: powerclamp: Add two module parameters")
Signed-off-by: David Arcari <darcari@redhat.com>
Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the sake of consistency, revert the second part of the
thermal_hwmon.c hunk from commit dec07d399c ("thermal: Don't use
'device' internal thermal zone structure field") after the first
part of it has been reverted.
Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Commit 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix
deadlock") addressed deadlock issue during user space trip update. But it
missed a case when thermal zone device is disabled when user writes 0.
Call to thermal_zone_device_disable() also causes deadlock as it also
tries to lock tz->lock, which is already claimed by trip_point_temp_store()
in the thermal core code.
Remove call to thermal_zone_device_disable() in the function
sys_set_trip_temp(), which is called from trip_point_temp_store().
Fixes: 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix deadlock")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When the hwmon device node of a thermal zone device is not found,
using hwmon->device causes a kernel NULL pointer dereference.
Fixes: dec07d399c ("thermal: Don't use 'device' internal thermal zone structure field")
Reported-by: Preble Adam C <adam.c.preble@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The lockdep_assert_held() calls added to cooling_device_stats_setup()
and cooling_device_stats_destroy() by commit 790930f442 ("thermal:
core: Introduce thermal_cooling_device_update()") trigger false-positive
lockdep reports in code paths that are not subject to race conditions
(before cooling device registration and after cooling device removal).
For this reason, remove the lockdep_assert_held() calls from both
cooling_device_stats_setup() and cooling_device_stats_destroy() and
add one to thermal_cooling_device_stats_reinit() that has to be called
under the cdev lock.
Fixes: 790930f442 ("thermal: core: Introduce thermal_cooling_device_update()")
Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.com
Reported-by: Imre Deak <imre.deak@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip()
function") stopped marking trip points with a zero temperature as
disabled, behavior that was originally introduced in commit 81ad4276b5
("Thermal: Ignore invalid trip points").
When using the mlxsw driver we see that when such trip points are not
disabled, the thermal subsystem repeatedly tries to set the state of the
associated cooling devices to the maximum state.
Address this by restoring the original behavior and mark trip points
with a zero temperature as disabled.
Fixes: 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip() function")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Introduce a helper function, thermal_cooling_device_present(), for
checking if the given cooling device is in the list of registered
cooling devices to avoid some code duplication in a subsequent
patch.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
When setting a trip point temperature from sysfs, there is an upper
bound check on the user input, but no lower bound check.
As hardware register has 7 bits for a trip point temperature, the offset
to tj_max of the input temperature must be equal to/less than 0x7f.
Or else,
1. bogus temperature is updated into the trip temperature bits.
2. the upper bits of the register can be polluted.
For example,
$ rdmsr 0x1b2
2000003
$ echo -180000 > /sys/class/thermal/thermal_zone1/trip_point_1_temp
$ rdmsr 0x1b2
3980003
Not only the trip point temp is set to 76C on this platform (tj_max is
100), the Power Notification (Bit 24) is also enabled erronously.
Fix the problem by adding lower bound check for sysfs input.
Reported-by: Dan Carpenter <error27@gmail.com>
Link: https://lore.kernel.org/all/add7a378-4d50-4ba1-81d3-a0c17db25a0b@kili.mountain/
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MT8365 is similar to the other SoCs supported by the driver. It has only
one bank and 3 actual sensors that can be multiplexed. There is another
one sensor that does not have usable data.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-3-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add logic in order to be able to turn on the control buffer on MT8365.
This change now allows to have control buffer support for MTK_THERMAL_V1,
and it allows to define the register offset, and mask used to enable it.
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-2-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge thermal control updates for 6.4-rc1:
- Add a thermal zone 'devdata' accessor and modify several drivers to
use it (Daniel Lezcano).
- Prevent drivers from using the 'device' internal thermal zone
structure field directly (Daniel Lezcano).
- Clean up the hwmon thermal driver (Daniel Lezcano).
- Add thermal zone id accessor and thermal zone type accessor
and prevent drivers from using thermal zone fields directly (Daniel
Lezcano).
- Clean up the acerhdf and tegra thermal drivers (Daniel Lezcano).
* thermal-core:
thermal/drivers/acerhdf: Remove pointless governor test
thermal/drivers/acerhdf: Make interval setting only at module load time
thermal/drivers/tegra: Remove unneeded lock when setting a trip point
thermal/hwmon: Use the thermal_core.h header
thermal/drivers/da9062: Don't access the thermal zone device fields
thermal: Use thermal_zone_device_type() accessor
thermal: Add a thermal zone id accessor
thermal/drivers/spear: Don't use tz->device but pdev->dev
thermal/core: Add thermal_zone_device structure 'type' accessor
thermal: Don't use 'device' internal thermal zone structure field
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()
thermal: Remove debug or error messages in get_temp() ops
thermal/core: Show a debug message when get_temp() fails
thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers
thermal/core: Use the thermal zone 'devdata' accessor in hwmon located drivers
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
thermal/core: Add a thermal zone 'devdata' accessor
The function tegra_tsensor_enable_hw_channel() takes the thermal zone
lock to prevent "a potential" race with a call to set_trips()
callback.
The driver must not play with the thermal framework core code
internals.
The tegra_tsensor_enable_hw_channel() is called by:
- the suspend / resume callbacks
- the probe function after the thermal zones are registered
The thermal zone lock taken in this function is supposed to protect
from a call to the set_trips() callback which writes in the same
register.
The potential race is when suspend / resume are called at the same
time as set_trips. This one is called only in
thermal_zone_device_update().
- At suspend time, the 'in_suspend' is set, thus the
thermal_zone_device_update() bails out immediately and set_trips is
not called during this moment.
- At resume time, the thermal zone is updated at PM_POST_SUSPEND,
thus the driver has already set the TH2 temperature.
- At probe time, we register the thermal zone and then we set the
TH2. The only scenario I can see so far is the interrupt fires, the
thermal_zone_update() is called exactly at the moment
tegra_tsensor_enable_hw_channel() a few lines after registering it.
Enable the channels before setting up the interrupt. We close the
potential race window without using the thermal zone's lock.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Thierry Reding <thierry.reding@gmail.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal_hwmon is playing with the thermal core code
internals. Changing the code would be too invasive for now.
We can consider the thermal_hwmon.c is part of the thermal core code
as it provides a glue to tie the hwmon and the thermal zones.
Let's include the thermal_core.h header.
No functional change intended.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver is reading the passive polling rate in the thermal zone
structure. We want to prevent the drivers to rummage around in the
thermal zone structure.
On the other side, the delay is what the driver passed to the
thermal_zone_device_register() function, so it has already the
information.
Reuse the information we have instead of reading the information we
set.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Replace the accesses to 'tz->type' by its accessor version in order to
self-encapsulate the thermal_zone_device structure.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use the spear associated device instead of the thermal zone device
which belongs to the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some drivers are directly using the thermal zone's 'device' structure
field.
Use the driver device pointer instead of the thermal zone device when
it is available.
Remove the traces when they are duplicate with the traces in the core
code.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek LVTS
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.
Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.
Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
