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linux/Documentation/devicetree/bindings/vendor-prefixes.txt
Greg Kroah-Hartman eb7bfed901 First round of IIO new device support, features and cleanups for the 4.7 cycle. 
New core support
 * UV light modifier (for intensity)
 * UV light index channel type.
 
 New device support
 * hp206c barometer and altimeter
   - new driver.
 * mcp4131 potentiometer
   - new driver supporting lots of parts from Microchip.
 * mma8452
   - FXLS8471Q support
 - NXP LPC18XX SOC ADC
   - new driver.
 - NXP LPC18XX SOC DAC
   - new driver.
 - rockchip_saradc
   - support rk3399
 * st accel
   - h3lis331dl support
 
 Staging driver removals
 * adis16204
   - obsolete part making it hard to get parts to test the driver in order
     to clean it up.
 * adis16220
   - obsolete part making it hard to get the parts test the driver in order
     to clean it up.
 
 Features
 * core
   - convenience functions to claim / release direct access to the device.
     Makes more consistent handling of this corner easier. Used in ad7192 driver.
 * ak8975
   - power regulator support.
 * at91-sama5d2
   - differential channel support.
 * mma8452
   - runtime pm support
   - drop device specific autosleep and use the runtime pm one instead.
 * ms5611
   - DT bindings
   - oversampling ratio support
 
 Cleanups and minor fixes
 * MAINTAINERS
   - Peter got married - hence name change!
 
 * Documentation
   - Fix a typo in in_proximity_raw description.
   - Add some missing docs for iio_buffer_access_funcs.
 
 * Tools
   - update iio_event_monitor names to match new stuff.
   - make generic_buffer look for triggers ending in -trigger as we let these in
   for a number of drivers a long time back and now it is a fairly common
   option.
 
 Drivers
 * staging wide
   - convert bare unsigned usage to unsigned int to comply with coding style.
 * non staging wide:
   - since boiler plate gpio handling of interrupts has been moved into the
    ACPI core we don't need to include gpio/consumer.h in a load of drivers so
    drop it.
 * ad7606
   - fix an endian casting sparse warning.
 * ak8975
   - fix a possible unitialized warning from gcc.
   - drop and unused field left over from earlier cleanups
   - fix a missing regulator_disable on exit.
 * at91-sama5d2
   - typo and indentation
   - missing IOMEM dependency.
   - cleanup mode register usage by avoidling erasing whole thing when changing
   the sampling frequency.
 * bmc150
   - use the core demux and available_scan_masks to simplify buffer handling
   - optimize the transfers in the trigger handler now we have a magic function
   to emulate bulk reads (under circumstances met here).  This matters with some
   rather dumb i2c adapters in particular.
   - use a single regmap_conf for all bus types as they were all the same.
 * bmg160
   - use the core demux and available_scan_masks to simplify the buffer handling
   - optimize the transfers in the trigger handler now we have a magic funciton
   to emulate bulk rads (under circumstances met here).
   - drop gpio interrupt probing from the driver (ACPI) as now handled by the
   ACPI core.
 * ina2xx-adc
   - update the CALIB register when RShunt changes.
   - fix scale for VShunt - in reality this error canceled out when used.
 * isl29028
   - use regmap to retrieve the struct device instead of carrying a second
   copy of it around.
 * kxcjk-1013
   - use core demux
   - optimize i2c transfers in the trigger handler.
 * mcp4531
   - refactor to use a pointer to access model parameters instead of indexing
     into the array each time.
 * mma8452
   - style fixes
   - avoid swtiching to active whenever the config changes
   - add missin i2c_device_id for mma8451
 * mpu6050
   - fix possible NULL dereference.
   - fix the name / chip_id used when ACPI used (otherwise reports as NULL).
 * ms5611
   - fix a missing regulator_disable that left the regulator on during removal.
 * mxc4005
   - drop gpio interrupt handling for ACPI case from driver as the core now
   handles this case.
 * st-sensors
   - note that there are only ever a maximum of 3 axis on current st-sensors
   so just allocate a fixed sized buffer big enough for that.
 * tpl0102
   - change the i2c_check_functionality condition to bring it inline with other
     IIO users as EOPNOTSUPP.
 * tsl2563
   - replace deprecated flush_scheduled_work
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Merge tag 'iio-for-4.7a' of git://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio into staging-next

Jonathan writes:

First round of IIO new device support, features and cleanups for the 4.7 cycle.

New core support
* UV light modifier (for intensity)
* UV light index channel type.

New device support
* hp206c barometer and altimeter
  - new driver.
* mcp4131 potentiometer
  - new driver supporting lots of parts from Microchip.
* mma8452
  - FXLS8471Q support
- NXP LPC18XX SOC ADC
  - new driver.
- NXP LPC18XX SOC DAC
  - new driver.
- rockchip_saradc
  - support rk3399
* st accel
  - h3lis331dl support

Staging driver removals
* adis16204
  - obsolete part making it hard to get parts to test the driver in order
    to clean it up.
* adis16220
  - obsolete part making it hard to get the parts test the driver in order
    to clean it up.

Features
* core
  - convenience functions to claim / release direct access to the device.
    Makes more consistent handling of this corner easier. Used in ad7192 driver.
* ak8975
  - power regulator support.
* at91-sama5d2
  - differential channel support.
* mma8452
  - runtime pm support
  - drop device specific autosleep and use the runtime pm one instead.
* ms5611
  - DT bindings
  - oversampling ratio support

Cleanups and minor fixes
* MAINTAINERS
  - Peter got married - hence name change!

* Documentation
  - Fix a typo in in_proximity_raw description.
  - Add some missing docs for iio_buffer_access_funcs.

* Tools
  - update iio_event_monitor names to match new stuff.
  - make generic_buffer look for triggers ending in -trigger as we let these in
  for a number of drivers a long time back and now it is a fairly common
  option.

Drivers
* staging wide
  - convert bare unsigned usage to unsigned int to comply with coding style.
* non staging wide:
  - since boiler plate gpio handling of interrupts has been moved into the
   ACPI core we don't need to include gpio/consumer.h in a load of drivers so
   drop it.
* ad7606
  - fix an endian casting sparse warning.
* ak8975
  - fix a possible unitialized warning from gcc.
  - drop and unused field left over from earlier cleanups
  - fix a missing regulator_disable on exit.
* at91-sama5d2
  - typo and indentation
  - missing IOMEM dependency.
  - cleanup mode register usage by avoidling erasing whole thing when changing
  the sampling frequency.
* bmc150
  - use the core demux and available_scan_masks to simplify buffer handling
  - optimize the transfers in the trigger handler now we have a magic function
  to emulate bulk reads (under circumstances met here).  This matters with some
  rather dumb i2c adapters in particular.
  - use a single regmap_conf for all bus types as they were all the same.
* bmg160
  - use the core demux and available_scan_masks to simplify the buffer handling
  - optimize the transfers in the trigger handler now we have a magic funciton
  to emulate bulk rads (under circumstances met here).
  - drop gpio interrupt probing from the driver (ACPI) as now handled by the
  ACPI core.
* ina2xx-adc
  - update the CALIB register when RShunt changes.
  - fix scale for VShunt - in reality this error canceled out when used.
* isl29028
  - use regmap to retrieve the struct device instead of carrying a second
  copy of it around.
* kxcjk-1013
  - use core demux
  - optimize i2c transfers in the trigger handler.
* mcp4531
  - refactor to use a pointer to access model parameters instead of indexing
    into the array each time.
* mma8452
  - style fixes
  - avoid swtiching to active whenever the config changes
  - add missin i2c_device_id for mma8451
* mpu6050
  - fix possible NULL dereference.
  - fix the name / chip_id used when ACPI used (otherwise reports as NULL).
* ms5611
  - fix a missing regulator_disable that left the regulator on during removal.
* mxc4005
  - drop gpio interrupt handling for ACPI case from driver as the core now
  handles this case.
* st-sensors
  - note that there are only ever a maximum of 3 axis on current st-sensors
  so just allocate a fixed sized buffer big enough for that.
* tpl0102
  - change the i2c_check_functionality condition to bring it inline with other
    IIO users as EOPNOTSUPP.
* tsl2563
  - replace deprecated flush_scheduled_work
2016-04-04 12:31:05 -07:00

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
abilis Abilis Systems
abcn Abracon Corporation
active-semi Active-Semi International Inc
ad Avionic Design GmbH
adapteva Adapteva, Inc.
adh AD Holdings Plc.
adi Analog Devices, Inc.
advantech Advantech Corporation
aeroflexgaisler Aeroflex Gaisler AB
al Annapurna Labs
allwinner Allwinner Technology Co., Ltd.
alphascale AlphaScale Integrated Circuits Systems, Inc.
altr Altera Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
amd Advanced Micro Devices (AMD), Inc.
amlogic Amlogic, Inc.
ampire Ampire Co., Ltd.
ams AMS AG
amstaos AMS-Taos Inc.
apm Applied Micro Circuits Corporation (APM)
aptina Aptina Imaging
arasan Arasan Chip Systems
arm ARM Ltd.
armadeus ARMadeus Systems SARL
artesyn Artesyn Embedded Technologies Inc.
asahi-kasei Asahi Kasei Corp.
atlas Atlas Scientific LLC
atmel Atmel Corporation
auo AU Optronics Corporation
avago Avago Technologies
avic Shanghai AVIC Optoelectronics Co., Ltd.
axis Axis Communications AB
boe BOE Technology Group Co., Ltd.
bosch Bosch Sensortec GmbH
boundary Boundary Devices Inc.
brcm Broadcom Corporation
buffalo Buffalo, Inc.
calxeda Calxeda
capella Capella Microsystems, Inc
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
ceva Ceva, Inc.
chipidea Chipidea, Inc
chipone ChipOne
chipspark ChipSPARK
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
ciaa Computadora Industrial Abierta Argentina
cirrus Cirrus Logic, Inc.
cloudengines Cloud Engines, Inc.
cnm Chips&Media, Inc.
cnxt Conexant Systems, Inc.
compulab CompuLab Ltd.
cortina Cortina Systems, Inc.
cosmic Cosmic Circuits
crystalfontz Crystalfontz America, Inc.
cubietech Cubietech, Ltd.
cypress Cypress Semiconductor Corporation
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
delta Delta Electronics, Inc.
denx Denx Software Engineering
digi Digi International Inc.
digilent Diglent, Inc.
dlg Dialog Semiconductor
dlink D-Link Corporation
dmo Data Modul AG
ea Embedded Artists AB
ebv EBV Elektronik
edt Emerging Display Technologies
eeti eGalax_eMPIA Technology Inc
elan Elan Microelectronic Corp.
emmicro EM Microelectronic
energymicro Silicon Laboratories (formerly Energy Micro AS)
epcos EPCOS AG
epfl Ecole Polytechnique Fédérale de Lausanne
epson Seiko Epson Corp.
est ESTeem Wireless Modems
ettus NI Ettus Research
eukrea Eukréa Electromatique
everest Everest Semiconductor Co. Ltd.
everspin Everspin Technologies, Inc.
excito Excito
fcs Fairchild Semiconductor
firefly Firefly
focaltech FocalTech Systems Co.,Ltd
fsl Freescale Semiconductor
ge General Electric Company
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
geniatech Geniatech, Inc.
giantplus Giantplus Technology Co., Ltd.
globalscale Globalscale Technologies, Inc.
gmt Global Mixed-mode Technology, Inc.
goodix Shenzhen Huiding Technology Co., Ltd.
google Google, Inc.
grinn Grinn
gumstix Gumstix, Inc.
gw Gateworks Corporation
hannstar HannStar Display Corporation
haoyu Haoyu Microelectronic Co. Ltd.
hardkernel Hardkernel Co., Ltd
himax Himax Technologies, Inc.
hisilicon Hisilicon Limited.
hit Hitachi Ltd.
hitex Hitex Development Tools
holt Holt Integrated Circuits, Inc.
honeywell Honeywell
hp Hewlett Packard
i2se I2SE GmbH
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
ifi Ingenieurburo Fur Ic-Technologie (I/F/I)
iom Iomega Corporation
img Imagination Technologies Ltd.
ingenic Ingenic Semiconductor
innolux Innolux Corporation
intel Intel Corporation
intercontrol Inter Control Group
invensense InvenSense Inc.
isee ISEE 2007 S.L.
isil Intersil
issi Integrated Silicon Solutions Inc.
jedec JEDEC Solid State Technology Association
karo Ka-Ro electronics GmbH
keymile Keymile GmbH
kinetic Kinetic Technologies
kosagi Sutajio Ko-Usagi PTE Ltd.
kyo Kyocera Corporation
lacie LaCie
lantiq Lantiq Semiconductor
lenovo Lenovo Group Ltd.
lg LG Corporation
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
lltc Linear Technology Corporation
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
meas Measurement Specialties
mediatek MediaTek Inc.
melexis Melexis N.V.
merrii Merrii Technology Co., Ltd.
micrel Micrel Inc.
microchip Microchip Technology Inc.
micron Micron Technology Inc.
minix MINIX Technology Ltd.
mitsubishi Mitsubishi Electric Corporation
mosaixtech Mosaix Technologies, Inc.
moxa Moxa
mpl MPL AG
msi Micro-Star International Co. Ltd.
mti Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
mundoreader Mundo Reader S.L.
murata Murata Manufacturing Co., Ltd.
mxicy Macronix International Co., Ltd.
national National Semiconductor
nec NEC LCD Technologies, Ltd.
neonode Neonode Inc.
netgear NETGEAR
netlogic Broadcom Corporation (formerly NetLogic Microsystems)
netxeon Shenzhen Netxeon Technology CO., LTD
newhaven Newhaven Display International
nintendo Nintendo
nokia Nokia
nuvoton Nuvoton Technology Corporation
nvidia NVIDIA
nxp NXP Semiconductors
okaya Okaya Electric America, Inc.
olimex OLIMEX Ltd.
onnn ON Semiconductor Corp.
opencores OpenCores.org
option Option NV
ortustech Ortus Technology Co., Ltd.
ovti OmniVision Technologies
ORCL Oracle Corporation
panasonic Panasonic Corporation
parade Parade Technologies Inc.
pericom Pericom Technology Inc.
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
plathome Plat'Home Co., Ltd.
plda PLDA
pixcir PIXCIR MICROELECTRONICS Co., Ltd
pulsedlight PulsedLight, Inc
powervr PowerVR (deprecated, use img)
qca Qualcomm Atheros, Inc.
qcom Qualcomm Technologies, Inc
qemu QEMU, a generic and open source machine emulator and virtualizer
qi Qi Hardware
qiaodian QiaoDian XianShi Corporation
qnap QNAP Systems, Inc.
radxa Radxa
raidsonic RaidSonic Technology GmbH
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
raspberrypi Raspberry Pi Foundation
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
richtek Richtek Technology Corporation
ricoh Ricoh Co. Ltd.
rockchip Fuzhou Rockchip Electronics Co., Ltd
samsung Samsung Semiconductor
sandisk Sandisk Corporation
sbs Smart Battery System
schindler Schindler
seagate Seagate Technology PLC
semtech Semtech Corporation
sgx SGX Sensortech
sharp Sharp Corporation
si-en Si-En Technology Ltd.
sigma Sigma Designs, Inc.
sil Silicon Image
silabs Silicon Laboratories
siliconmitus Silicon Mitus, Inc.
simtek
sii Seiko Instruments, Inc.
silergy Silergy Corp.
sirf SiRF Technology, Inc.
sitronix Sitronix Technology Corporation
skyworks Skyworks Solutions, Inc.
smsc Standard Microsystems Corporation
snps Synopsys, Inc.
socionext Socionext Inc.
solidrun SolidRun
solomon Solomon Systech Limited
sony Sony Corporation
spansion Spansion Inc.
sprd Spreadtrum Communications Inc.
st STMicroelectronics
startek Startek
ste ST-Ericsson
stericsson ST-Ericsson
syna Synaptics Inc.
synology Synology, Inc.
SUNW Sun Microsystems, Inc
tbs TBS Technologies
tcl Toby Churchill Ltd.
technologic Technologic Systems
thine THine Electronics, Inc.
ti Texas Instruments
tlm Trusted Logic Mobility
toradex Toradex AG
toshiba Toshiba Corporation
toumaz Toumaz
tplink TP-LINK Technologies Co., Ltd.
tronfy Tronfy
tronsmart Tronsmart
truly Truly Semiconductors Limited
upisemi uPI Semiconductor Corp.
urt United Radiant Technology Corporation
usi Universal Scientific Industrial Co., Ltd.
v3 V3 Semiconductor
variscite Variscite Ltd.
via VIA Technologies, Inc.
virtio Virtual I/O Device Specification, developed by the OASIS consortium
vivante Vivante Corporation
voipac Voipac Technologies s.r.o.
wexler Wexler
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
x-powers X-Powers
xes Extreme Engineering Solutions (X-ES)
xillybus Xillybus Ltd.
xlnx Xilinx
zyxel ZyXEL Communications Corp.
zarlink Zarlink Semiconductor
zii Zodiac Inflight Innovations
zte ZTE Corp.
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