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linux/Documentation/devicetree/bindings/thermal
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Krzysztof Kozlowski 3367934dd3 dt-bindings: drop redundant part of title (manual) 
The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding" or a "schema", but instead just describe
the hardware.

Manual updates to various binding titles, including capitalizing them.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp
Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org
[robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml]
Signed-off-by: Rob Herring <robh@kernel.org>
2022-12-16 12:51:43 -06:00
..
allwinner,sun8i-a83t-ths.yaml dt-bindings: Remove 'Device Tree Bindings' from end of title: 2022-08-25 14:06:57 -05:00
amazon,al-thermal.txt dt-bindings: thermal: Get rid of thermal.txt and replace references 2020-07-21 10:40:08 +02:00
amlogic,thermal.yaml dt-bindings: Clean-up schema indentation formatting 2020-04-16 16:59:22 -05:00
armada-thermal.txt docs: dt: fix references to ap806-system-controller.txt 2020-03-31 09:03:34 -06:00
brcm,avs-ro-thermal.yaml dt-bindings: Fix typo in comment 2022-07-21 13:14:27 -06:00
brcm,avs-tmon.yaml dt-bindings: thermal: Convert Broadcom TMON to YAML 2021-12-14 14:27:58 -06:00
brcm,bcm2835-thermal.txt dt-bindings: thermal: Get rid of thermal.txt and replace references 2020-07-21 10:40:08 +02:00
brcm,ns-thermal.yaml dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema 2021-04-21 20:42:48 +02:00
brcm,sr-thermal.txt dt-bindings: thermal: Add binding document for SR thermal 2019-02-05 16:05:02 -08:00
da9062-thermal.txt
db8500-thermal.txt
dove-thermal.txt
fsl,scu-thermal.yaml dt-bindings: drop redundant part of title (manual) 2022-12-16 12:51:43 -06:00
generic-adc-thermal.yaml dt-bindings: thermal: Convert generic-adc-thermal to DT schema 2022-12-14 15:25:39 +01:00
hisilicon-thermal.txt dt-bindings: thermal: Get rid of thermal.txt and replace references 2020-07-21 10:40:08 +02:00
imx8mm-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
imx-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
kirkwood-thermal.txt
max77620_thermal.txt dt-bindings: thermal: Get rid of thermal.txt and replace references 2020-07-21 10:40:08 +02:00
mediatek-thermal.txt dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC 2022-12-14 15:25:40 +01:00
nvidia,tegra30-tsensor.yaml dt-bindings: thermal: Add binding for Tegra30 thermal sensor 2021-07-04 18:28:04 +02:00
nvidia,tegra124-soctherm.txt dt-bindings: Fix typo in comment 2022-07-21 13:14:27 -06:00
nvidia,tegra186-bpmp-thermal.yaml dt-bindings: thermal: tegra186-bpmp: Convert to json-schema 2021-12-17 14:58:05 +01:00
qcom-lmh.yaml dt-bindings: Drop type from 'cpus' property 2022-12-06 14:50:35 -06:00
qcom-spmi-adc-tm5.yaml dt-bindings: iio: qcom: adc7-pm8350: Allow specifying SID for channels 2022-11-06 21:11:11 -06:00
qcom-spmi-adc-tm-hc.yaml dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings 2021-10-15 09:13:55 +02:00
qcom-tsens.yaml More thermal control updates for 6.2-rc1 2022-12-15 10:16:04 -08:00
qcom,spmi-temp-alarm.yaml dt-bindings: thermal: qcom,spmi-temp-alarm: convert to dtschema 2022-07-28 17:29:44 +02:00
qoriq-thermal.yaml dt-bindings: thermal: Convert qoriq to json-schema 2020-06-15 10:18:52 -06:00
rcar-gen3-thermal.yaml dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 support 2022-07-28 17:29:45 +02:00
rcar-thermal.yaml dt-bindings: Fix incorrect "the the" corrections 2022-08-18 10:59:33 -07:00
rockchip-thermal.yaml dt-bindings: thermal: remove redundant comments from rockchip-thermal.yaml 2021-10-17 00:14:55 +02:00
rzg2l-thermal.yaml dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC 2022-12-14 15:25:41 +01:00
samsung,exynos-thermal.yaml dt-bindings: update Krzysztof Kozlowski's email 2022-04-04 15:43:20 +02:00
socionext,uniphier-thermal.yaml dt-bindings: thermal: uniphier: Add binding for NX1 SoC 2021-10-18 13:59:57 +02:00
spear-thermal.txt
sprd-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
st-thermal.txt
st,stm32-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-cooling-devices.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-idle.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-sensor.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-zones.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti_soc_thermal.txt
ti,am654-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti,j72xx-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00