Marco Felsch e942307556 iio: temperature: tmp117: cosmetic alignment cleanup ... Align the code correctly if possible and align the channel bit mask to make it easier to read. Signed-off-by: Marco Felsch <m.felsch@pengutronix.de> Link: https://lore.kernel.org/r/20230228090518.529811-6-m.felsch@pengutronix.de Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>		2023-03-11 12:18:29 +00:00
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hid-sensor-temperature.c	iio: hid-sensors: Update header includes	2021-06-16 14:53:13 +01:00
iqs620at-temp.c	iio: temperature: iqs620at-temp: Add support for V3 silicon	2022-02-14 13:07:33 +00:00
Kconfig	iio: temperature: Add driver support for Maxim MAX30208	2022-11-23 20:20:32 +00:00
ltc2983.c	iio: temperature: ltc2983: support more parts	2022-11-23 19:54:00 +00:00
Makefile	iio: temperature: Add driver support for Maxim MAX30208	2022-11-23 20:20:32 +00:00
max30208.c	iio: temperature: Add driver support for Maxim MAX30208	2022-11-23 20:20:32 +00:00
max31856.c	iio: temperature: max31856: Make use of device properties	2022-04-28 19:22:55 +01:00
max31865.c	iio: temp: max31865: Fix alignment for DMA safety	2022-06-14 11:53:19 +01:00
maxim_thermocouple.c	iio: temp: maxim_thermocouple: Fix alignment for DMA safety	2022-06-14 11:53:19 +01:00
mlx90614.c	iio: temperature: mlx90614: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00
mlx90632.c	iio: temperature: mlx90632: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00
tmp006.c	iio: temperature: tmp006: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00
tmp007.c	iio: temperature: tmp007: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00
tmp117.c	iio: temperature: tmp117: cosmetic alignment cleanup	2023-03-11 12:18:29 +00:00
tsys01.c	iio: temperature: tsys01: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00
tsys02d.c	iio: temperature: tsys02d: Convert to i2c's .probe_new()	2022-11-23 20:20:32 +00:00