Zhang Rui b81b6ba3d9 Thermal: rename structure thermal_cooling_device_instance to thermal_instance ... This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>		2012-09-24 14:44:37 +08:00
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Kconfig	drivers/thermal/spear_thermal.c: add Device Tree probing capability	2012-06-02 01:49:38 -04:00
Makefile	thermal: add support for thermal sensor present on SPEAr13xx machines	2012-03-22 01:05:32 -04:00
spear_thermal.c	Thermal: Remove tc1/tc2 in generic thermal layer.	2012-09-24 14:44:36 +08:00
thermal_sys.c	Thermal: rename structure thermal_cooling_device_instance to thermal_instance	2012-09-24 14:44:37 +08:00