Vadim Pasternak ef0df4fa32 mlxsw: core_thermal: Extend internal structures to support multi thermal areas
Introduce intermediate level for thermal zones areas.
Currently all thermal zones are associated with thermal objects located
within the main board. Such objects are created during driver
initialization and removed during driver de-initialization.

For line cards in modular system the thermal zones are to be associated
with the specific line card. They should be created whenever new line
card is available (inserted, validated, powered and enabled) and
removed, when line card is getting unavailable.
The thermal objects found on the line card #n are accessed by setting
slot index to #n, while for access to objects found on the main board
slot index should be set to default value zero.

Each thermal area contains the set of thermal zones associated with
particular slot index.
Thus introduction of thermal zone areas allows to use the same APIs for
the main board and line cards, by adding slot index argument.

Signed-off-by: Vadim Pasternak <vadimp@nvidia.com>
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
2022-04-15 11:06:13 +01:00
2022-04-01 16:20:00 -07:00
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Linux kernel
============

There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.

In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``.  The formatted documentation can also be read online at:

    https://www.kernel.org/doc/html/latest/

There are various text files in the Documentation/ subdirectory,
several of them using the Restructured Text markup notation.

Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.
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