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Setting polling_delay is now done at thermal_core level (by not polling
DISABLED devices), so no need to repeat this code.
int340x: Checking for an impossible enum value is unnecessary.
acpi/thermal: It only prints debug messages.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-11-andrzej.p@collabora.com
Polling DISABLED devices is not desired, as all such "disabled" devices
are meant to be handled by userspace. This patch introduces and uses
should_stop_polling() to decide whether the device should be polled or not.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-10-andrzej.p@collabora.com
Some thermal zone devices never change their state, so they should be
always enabled.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-9-andrzej.p@collabora.com
Use thermal_zone_device_{en|dis}able() and thermal_zone_device_is_enabled().
Consequently, all set_mode() implementations in drivers:
- can stop modifying tzd's "mode" member,
- shall stop taking tzd's lock, as it is taken in the helpers
- shall stop calling thermal_zone_device_update() as it is called in the
helpers
- can assume they are called when the mode truly changes, so checks to
verify that can be dropped
Not providing set_mode() by a driver no longer prevents the core from
being able to set tzd's mode, so the relevant check in mode_store() is
removed.
Other comments:
- acpi/thermal.c: tz->thermal_zone->mode will be updated only after we
return from set_mode(), so use function parameter in thermal_set_mode()
instead, no need to call acpi_thermal_check() in set_mode()
- thermal/imx_thermal.c: regmap writes and mode assignment are done in
thermal_zone_device_{en|dis}able() and set_mode() callback
- thermal/intel/intel_quark_dts_thermal.c: soc_dts_{en|dis}able() are a
part of set_mode() callback, so they don't need to modify tzd->mode, and
don't need to fall back to the opposite mode if unsuccessful, as the return
value will be propagated to thermal_zone_device_{en|dis}able() and
ultimately tzd's member will not be changed in thermal_zone_device_set_mode().
- thermal/of-thermal.c: no need to set zone->mode to DISABLED in
of_parse_thermal_zones() as a tzd is kzalloc'ed so mode is DISABLED anyway
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-8-andrzej.p@collabora.com
Prepare for making the drivers not access tzd's private members.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[staticize thermal_zone_device_set_mode()]
Signed-off-by: kernel test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-7-andrzej.p@collabora.com
get_mode() is now redundant, as the state is stored in struct
thermal_zone_device.
Consequently the "mode" attribute in sysfs can always be visible, because
it is always possible to get the mode from struct tzd.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-6-andrzej.p@collabora.com
As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h.
"Result is undefined for negative divisors if the dividend variable
type is unsigned and for negative dividends if the divisor variable
type is unsigned."
In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not
checked sign of divisor before using. It makes undefined temperature
value in case the value is negative.
This patch fixes to satisfy DIV_ROUND_CLOSEST description
and fix bug too. Note that the variable name "reg" is not good
because it should be the same type as rcar_gen3_thermal_read().
However, it's better to rename the "reg" in a further patch as
cleanup.
Signed-off-by: Van Do <van.do.xw@renesas.com>
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[shimoda: minor fixes, add Fixes tag]
Fixes: 564e73d283af ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com
The function cpu_power_to_freq is used to find a frequency and set the
cooling device to consume at most the power to be converted. For example,
if the power to be converted is 80mW, and the em table is as follow.
struct em_cap_state table[] = {
/* KHz mW */
{ 1008000, 36, 0 },
{ 1200000, 49, 0 },
{ 1296000, 59, 0 },
{ 1416000, 72, 0 },
{ 1512000, 86, 0 },
};
The target frequency should be 1416000KHz, not 1512000KHz.
Fixes: 349d39dc5739 ("thermal: cpu_cooling: merge frequency and power tables")
Cc: <stable@vger.kernel.org> # v4.13+
Signed-off-by: Finley Xiao <finley.xiao@rock-chips.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200619090825.32747-1-finley.xiao@rock-chips.com
After merging tsens-common.c into tsens.c, we can now mark some
functions static so they don't need any prototype declarations. This
fixes the following issue reported by lkp.
>> drivers/thermal/qcom/tsens.c:385:13: warning: no previous prototype for 'tsens_critical_irq_thread' [-Wmissing-prototypes]
385 | irqreturn_t tsens_critical_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:455:13: warning: no previous prototype for 'tsens_irq_thread' [-Wmissing-prototypes]
455 | irqreturn_t tsens_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:523:5: warning: no previous prototype for 'tsens_set_trips' [-Wmissing-prototypes]
523 | int tsens_set_trips(void *_sensor, int low, int high)
| ^~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:560:5: warning: no previous prototype for 'tsens_enable_irq' [-Wmissing-prototypes]
560 | int tsens_enable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:573:6: warning: no previous prototype for 'tsens_disable_irq' [-Wmissing-prototypes]
573 | void tsens_disable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~~
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/6757a26876b29922929abf64b1c11fa3b3033d03.1590579709.git.amit.kucheria@linaro.org
When call function devm_platform_ioremap_resource(), we should use IS_ERR()
to check the return value and return PTR_ERR() if failed.
Fixes: 554fdbaf19b1 ("thermal: sprd: Add Spreadtrum thermal driver support")
Signed-off-by: Tiezhu Yang <yangtiezhu@loongson.cn>
Reviewed-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1590371941-25430-1-git-send-email-yangtiezhu@loongson.cn
MT8183_NUM_ZONES should be set to 1
because MT8183 doesn't have multiple banks.
Fixes: a4ffe6b52d27 ("thermal: mediatek: add support for MT8183")
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200323121537.22697-6-michael.kao@mediatek.com
The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.
This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
The Energy Model uses concept of performance domain and capacity states in
order to calculate power used by CPUs. Change naming convention from
capacity to performance state would enable wider usage in future, e.g.
upcoming support for other devices other than CPUs.
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Quentin Perret <qperret@google.com>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because SCHED_FIFO is a broken scheduler model (see previous patches)
take away the priority field, the kernel can't possibly make an
informed decision.
Effectively no change.
Cc: rafael.j.wysocki@intel.com
Signed-off-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
-----BEGIN PGP SIGNATURE-----
iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAl7jra8ACgkQqDIjiipP
6E+ugAgApBF6FsHoonWIvoSrzBrrbU2oqhEJA42Mx+iY/UnXi01I79vZ/8WpZt7M
D1J01Kf0PUhRbywoKaoCX3Oh9ZO9PKq4N9ZC8yqdoD6GLl+rC9Wmr7Ui+c80klcv
M9rYhpPYfNXTFj0saSbbFWNNhP4TvhzGsNj8foYVQDKyhjbSmNE5ipZlbmP23jlr
O53SmJAwS5zxLOd8QA5nfSWP9FYYMuCR2AHj8BUCmxiAjXZLPNB/Hz2RRBr7q0MF
zRo/4HJ04mSQYp0kluP/EBhz9g2wM/htIPyWRveB/ByKEYt3UNKjB++PJmPbu5UG
dS3aXZhRfaPqpdsWrMB9fY7ll+oyfw==
=T+RI
-----END PGP SIGNATURE-----
Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
The IDSP method doesn't appear to exist on the most recent Intel platforms:
instead, the IDSP data is included in the GDDV blob. Since we probably
don't want to decompress and parse that in-kernel, just allow any UUID to
be written if IDSP is missing.
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
[ rzhang: fix checkpatch warning in changelog ]
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-3-matthewgarrett@google.com
The platform vendor may expose an array of OEM-specific values to be used
in determining DPTF policy. These are obtained via the ODVP method, and
then simply exposed in sysfs. In addition, they are updated when a
notification is received or when the DPTF policy is changed by userland.
Conflicts:
drivers/thermal/intel/int340x_thermal/int3400_thermal.c
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-2-matthewgarrett@google.com
Implementing DPTF properly requires making use of firmware-provided
information associated with the INT3400 device. Calling GDDV provides a
buffer of information which userland can then interpret to determine
appropriate DPTF policy.
Conflicts:
drivers/thermal/intel/int340x_thermal/int3400_thermal.c
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-1-matthewgarrett@google.com
For TMU v2, TMSAR registers need to be set properly to get the
accurate temperature values.
Also the temperature read needs to be converted to degree Celsius
since it is in degrees Kelvin.
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200526060212.4118-1-andy.tang@nxp.com
Moving the ctemp variable out of the private data structure made it
possible to clean up rcar_thermal_update_temp(). Initialize the local
ctemp to the error code to return if the reading fails and just return
it at the end of the function.
It's OK to change the datatype of old, new and ctemp to int as all
values are ANDed with CTEMP (0x3f) before being stored. While at it
change the datatype of the loop variable 'i' to to unsigned int.
Suggested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200514152505.1927634-1-niklas.soderlund+renesas@ragnatech.se
The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_THERMAL config symbol, to avoid asking the user about it
when configuring a kernel without support for any of the aforementioned
SoCs.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Li Yang <leoyang.li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
tsens-common.c has outlived its usefuless. It was created expecting lots
of custom routines per version of the TSENS IP. We haven't needed those,
there is now only data in the version-specific files.
Merge the code for tsens-common.c into tsens.c. As a result,
- Remove any unnecessary forward declarations in tsens.h.
- Add a Linaro copyright to tsens.c.
- Fixup the Makefile to remove tsens-common.c.
- Where it made sense, fix some 80-column alignments in the
tsens-common.c code being copied over.
There is no functional change with this patch.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e30e2ba6fa5c007983afd4d7d4e0311c0b57917a.1588183879.git.amit.kucheria@linaro.org
The thermal framework can no longer be compiled as a module as of
commit 554b3529fe01 ("thermal/drivers/core: Remove the module Kconfig's
option"). Remove the MODULE_* tags.
Rui is mentioned in the copyright line at the top of the file and the
license is mentioned in the SPDX tags. So no loss of information.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/74339a09a55f8f3d86c4074fc2bf853a302d6186.1589199124.git.amit.kucheria@linaro.org
The current codebase makes use of the zero-length array language
extension to the C90 standard, but the preferred mechanism to declare
variable-length types such as these ones is a flexible array member[1][2],
introduced in C99:
struct foo {
int stuff;
struct boo array[];
};
By making use of the mechanism above, we will get a compiler warning
in case the flexible array does not occur last in the structure, which
will help us prevent some kind of undefined behavior bugs from being
inadvertently introduced[3] to the codebase from now on.
Also, notice that, dynamic memory allocations won't be affected by
this change:
"Flexible array members have incomplete type, and so the sizeof operator
may not be applied. As a quirk of the original implementation of
zero-length arrays, sizeof evaluates to zero."[1]
sizeof(flexible-array-member) triggers a warning because flexible array
members have incomplete type[1]. There are some instances of code in
which the sizeof operator is being incorrectly/erroneously applied to
zero-length arrays and the result is zero. Such instances may be hiding
some bugs. So, this work (flexible-array member conversions) will also
help to get completely rid of those sorts of issues.
This issue was found with the help of Coccinelle.
[1] https://gcc.gnu.org/onlinedocs/gcc/Zero-Length.html
[2] https://github.com/KSPP/linux/issues/21
[3] commit 76497732932f ("cxgb3/l2t: Fix undefined behaviour")
Signed-off-by: Gustavo A. R. Silva <gustavoars@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507192517.GA16557@embeddedor
Today, there is no user for the cpuidle cooling device. The targetted
platform is ARM and ARM64.
The cpuidle and the cpufreq cooling device are based on the device tree.
As the cpuidle cooling device can have its own configuration depending
on the platform and the available idle states. The DT node description
will give the optional properties to set the cooling device up.
Do no longer rely on the CPU node which is prone to error and will
lead to a confusion in the DT because the cpufreq cooling device is
also using it. Let initialize the cpuidle cooling device with the DT
binding.
This was tested on:
- hikey960
- hikey6220
- rock960
- db845c
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Tested-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
i.MX8 SoCs DTS file needs system control macro definitions, so move them
into dt-binding headfile, then include/linux/firmware/imx/types.h can be
removed and those drivers using it should be changed accordingly.
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
On error the function ti_bandgap_get_sensor_data() returns the error
code in ERR_PTR() but we only checked if the return value is NULL or
not. And, so we can dereference an error code inside ERR_PTR.
While at it, convert a check to IS_ERR_OR_NULL.
Signed-off-by: Sudip Mukherjee <sudipm.mukherjee@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200424161944.6044-1-sudipm.mukherjee@gmail.com
int3400_thermal_ops is used inside int3400_thermal_probe() only after
the assignments, which can just as well be made statically at struct's
initizer.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200414180105.20042-2-andrzej.p@collabora.com
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
The function “platform_get_irq” can log an error already.
Thus omit redundant messages for the exception handling in the
calling functions.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/05f49ae7-5cc7-d6a0-fc3d-abaf2a0b373c@web.de
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.
Move the structure to the thermal_core.h internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org
The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
