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Add marvell,armada-ap807-thermal compatible for the AP807 die.
Signed-off-by: Alex Leibovich <alexl@marvell.com>
Reviewed-by: Stefan Chulski <stefanc@marvell.com>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/E1qA7yP-00Ea4o-FS@rmk-PC.armlinux.org.uk
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ec9799504fe5a141e107bb78955d8d427f00553f.1686125196.git.quic_varada@quicinc.com
Convert the DT binding document for bcm2835-thermal from .txt to YAML.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230604121223.9625-10-stefan.wahren@i2se.com
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-2-99715746ddb1@linaro.org
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
warning (Stefan Wahren).
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten).
- Fix comments for the cpuidle_cooling_register() function to match the
function prototype (Chenggang Wang).
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno).
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen).
- Use of_address_to_resource() in the Mediatek driver (Rob Herring).
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski).
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
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Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Match unit-address to first reg entry.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230420072429.36255-1-krzysztof.kozlowski@linaro.org
Update the examples to reflect a future requirement for the generic
`channel` node name on ADC channel nodes, while conveying the board name
of the channel in a label instead.
Signed-off-by: Marijn Suijten <marijn.suijten@somainline.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410202917.247666-4-marijn.suijten@somainline.org
Currently the dtbs_check for imx6 generates warnings like this:
['fsl,imx6sll-tempmon', 'fsl,imx6sx-tempmon'] is too long
So add them to the devicetree binding.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410205803.45853-4-stefan.wahren@i2se.com
Cleanup bindings dropping unneeded quotes. Once all these are fixed,
checking for this can be enabled in yamllint.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org
Add a new compatible for the thermal sensor device on RK3588 SoCs.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-8-sebastian.reichel@collabora.com
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present.
Add unevaluatedProperties or additionalProperties as appropriate, and
then add any missing properties flagged by the addition.
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230124230228.372305-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Add the binding documentation for the thermal support on MT8365 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-1-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip RK3399
PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties
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Merge tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H
(R8A779G0) SoC.
Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3
sensors, so increase the maximum number of reg tuples.
Just like other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP but to the ECM.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.
Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.
Add new compatible for the tsens on msm8956 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Prior to adding dt-bindings for SoC-dependent controllers, rename the
thermal node and its parent node to the generic names in the example.
And drop a parent node of the thermal-sensor as it is not directly
necessary.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding" or a "schema", but instead just describe
the hardware.
Manual updates to various binding titles, including capitalizing them.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp
Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org
[robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml]
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "binding", but instead just describe the hardware.
Drop trailing "bindings" in various forms (also with trailing full
stop):
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \;
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq
Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada).
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong).
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi).
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson).
- Convert generic-adc-thermal to DT schema (Rob Herring).
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy).
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
- Add support for IPQ8074 in the tsens thermal driver along with the DT
bindings (Robert Marko).
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi).
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut).
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle).
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold).
- Add HWMon support for the imx8mm board (Alexander Stein).
- Remove pointless include from the power allocator governor (Christophe
JAILLET).
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski).
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
- Demote error log of thermal zone register to debug in the tsens QCom
driver (Manivannan Sadhasivam).
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof).
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar).
- Fix the irq handler return value in the LMh driver (Bjorn Andersson).
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL
SoC. "renesas,r9a07g043-tsu" compatible string will be used on the
RZ/Five SoC so to make this clear, update the comment to include RZ/Five
SoC.
No driver changes are required as generic compatible string
"renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Elaborate on the function of this device node as well as some of the
properties this node uses.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and described. They only missed the
constraints of number of interrupts.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
unit found in MT7986 SoCs.
'mediatek,mt7981-thermal' is also added as it is identical with the
thermal unit of MT7986.
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values from OCOTP. Document optional phandle to OCOTP nvmem
provider.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
We also have to make sure that correct interrupts are set according to
compatibles, so populate interrupt information per compatibles.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the 'generic-adc-thermal' binding to DT schema format.
The binding said '#thermal-sensor-cells' should be 1, but all in tree
users are 0 and 1 doesn't make sense for a single channel.
Drop the example's related providers and consumers of the
'generic-adc-thermal' node as the convention is to not have those in
the examples.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT Bindings:
- Various LED binding conversions and clean-ups. Convert the ir-spi-led,
pwm-ir-tx, and gpio-ir-tx LED bindings to schemas. Consistently
reference LED common.yaml or multi-led schemas and disallow undefined
properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or were
missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61
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Merge tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Various LED binding conversions and clean-ups. Convert the
ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas.
Consistently reference LED common.yaml or multi-led schemas and
disallow undefined properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or
were missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61"
* tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits)
dt-bindings: leds: Add missing references to common LED schema
dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property
of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop()
dt-bindings: lcdif: Fix constraints for imx8mp
media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties
dt-bindings: Drop Jee Heng Sia
dt-bindings: thermal: cooling-devices: Add missing cache related properties
dt-bindings: leds: irled: ir-spi-led: convert to DT schema
dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema
dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema
dt-bindings: leds: mt6360: rework to match multi-led
dt-bindings: leds: lp55xx: rework to match multi-led
dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix
dt-bindings: leds: lp55xx: allow label
dt-bindings: leds: use unevaluatedProperties for common.yaml
dt-bindings: thermal: tsens: Add SM6115 compatible
of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values
dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema
dt-bindings: Add missing start and/or end of line regex anchors
dt-bindings: qcom,pdc: Add missing compatibles
...
The examples' cache nodes are incomplete as 'cache-unified' and
'cache-level' are required cache properties.
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221104162450.1982114-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
'cpus' is a common property, and it is now defined in dtschema schemas,
so drop the type references in the tree.
Acked-by: Suzuki K Poulose <suzuki.poulse@arm.com>
Acked-by: Bjorn Andersson <andersson@kernel.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221111212857.4104308-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes
an error with new version of dtc:
FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle}
This is because the examples are built as an overlay and absolute paths
are not valid as references must be by label. The path was also not
resolvable because, by default, examples are placed under 'example-N'
nodes.
As the example contains top-level nodes, the root node must be explicit for
the example to be extracted as-is. This changes the indentation for the
whole example, but the existing indentation is a mess of of random amounts.
Clean this up to be 4 spaces everywhere.
Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC
has the static Slave ID (SID) assigned by default. The primary PMIC
PMK8350 is responsible for collecting the temperature/voltage data from
the slave PMICs and exposing them via it's registers.
For getting the measurements from the slave PMICs, PMK8350 uses the
channel ID encoded with the SID of the relevant PMIC. So far, the
dt-binding for the slave PMIC PM8350 assumed that there will be only
one PM8350 in a system. So it harcoded SID 1 with channel IDs.
But this got changed in platforms such as Lenovo X13s where there are a
couple of PM8350 PMICs available. So to address multiple PM8350s, change
the binding to accept the SID specified by the user and use it for
encoding the channel ID.
It should be noted that, even though the SID is static it is not
globally unique. Only the primary PMIC has the unique SID id 0.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for
compatible strings used in kernel sources against compatible strings
in DT schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems
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Merge tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for compatible
strings used in kernel sources against compatible strings in DT
schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema
titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems"
* tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits)
of: base: Shift refcount decrement in of_find_last_cache_level()
dt-bindings: leds: Add MediaTek MT6370 flashlight
dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator
dt-bindings: mailbox: Convert mtk-gce to DT schema
of: base: make of_device_compatible_match() accept const device node
of: Fix "dma-ranges" handling for bus controllers
of: fdt: Remove unused struct fdt_scan_status
dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node
dt-bindings: timer: Add power-domains for TI timer-dm on K3
dt: Add a check for undocumented compatible strings in kernel
kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs
dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML
dt-bindings: i2c: migrate mt7621 text bindings to YAML
dt-bindings: power: gpcv2: correct patternProperties
dt-bindings: virtio: Convert virtio,pci-iommu to DT schema
dt-bindings: timer: arm,arch_timer: Allow dual compatible string
dt-bindings: arm: cpus: Add kryo240 compatible
dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema
dt-bindings: nvmem: u-boot,env: add basic NVMEM cells
dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema
...
When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.
The initial text bindings was describing:
"
[ ... ]
* Thermal zone nodes
The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.
Required properties:
- polling-delay: The maximum number of milliseconds to wait between polls
Type: unsigned when checking this thermal zone.
Size: one cell
- polling-delay-passive: The maximum number of milliseconds to wait
Type: unsigned between polls when performing passive cooling.
Size: one cell
- thermal-sensors: A list of thermal sensor phandles and sensor specifier
Type: list of used while monitoring the thermal zone.
phandles + sensor
specifier
- trips: A sub-node which is a container of only trip point nodes
Type: sub-node required to describe the thermal zone.
Optional property:
- cooling-maps: A sub-node which is a container of only cooling device
Type: sub-node map nodes, used to describe the relation between trips
and cooling devices.
[ ... ]
"
Now the schema describes:
"
[ ... ]
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
[ ... ]
"
Add the missing 'trips' property in the required properties.
Fixed: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN
PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite
bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM memory
region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and
arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail
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Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
arm-firmware-suite bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM
memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
RTC, and arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail"
* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
dt-bindings: power: supply: drop quotes when not needed
dt-bindings: power: reset: drop quotes when not needed
dt-bindings: power: drop quotes when not needed
dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
of/fdt: declared return type does not match actual return type
devicetree/bindings: correct possessive "its" typos
dt-bindings: net: convert emac_rockchip.txt to YAML
dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
dt-bindings: display: use spi-peripheral-props.yaml
dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
dt-bindings: power: reset: qcom,pon: use absolute path to other schema
dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
of/fdt: Clean up early_init_dt_reserve_memory_arch()
dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
dt-bindings: rtc: ds1307: Convert to json-schema
...
